Altair announced a new High-Performance Computing (HPC) Cloud Challenge utilizing Amazon Web Services (AWS) and Intel technologies to demonstrate the benefits of leveraging the cloud for large-scale design exploration in the area of computer-aided engineering (CAE).

The Challenge asks CAE users to submit project ideas to a team of Altair, AWS and Intel representatives who then select qualified projects to accept into the program. Altair will supply accepted participants with software, computing resources, and product support for the duration of the program.

The Challenge aims to democratize the usage of cutting-edge CAE tools by reducing barriers for highly complex engineering tasks. Together, Altair, AWS and Intel bring performance, flexibility, scalability and affordability to CAE, triggering simulation-driven innovation.

Participants may choose from among six different configurations of Altair’s HyperWorks Unlimited™ (HWUL) Virtual Appliance, a turnkey software solution for high-performance computing in the cloud, in minutes.  Access is free of charge, and participants may use the Virtual Appliance for seven or more days to complete engineering tasks for their Challenge project. The lowest configuration starts with 32 cores and the highest can go up to 128 cores or more on the Intel® Xeon® processor E5 product family. The free use of Altair’s HWUL Virtual Appliance is supplemented through free credits from AWS.

“Getting a system ready in less than 15 minutes, with unlimited licensing of Altair’s industry-leading HyperWorks® application software and seamless integration with PBS Works™ middleware and Altair’s HyperStudy® for design of experiments and numerical optimization, paves the path for infinite design exploration. Making this completely turnkey for the engineer is our number one job,” said Ravi Kunju, Altair’s Vice President of Strategy and Business Development.

“This Cloud Challenge is a great opportunity for the engineering community to experience the power of scalable CAE capabilities on the AWS Cloud,” said Hugo Saleh, Director of Technical Computing Segment Marketing and Industry Development, Enterprise and HPC Platforms Group at Intel. “The collaboration with Altair and AWS brings the best of software, infrastructure, and hardware based on leading Intel E5 Xeon Processors, together to enable broader use of advanced simulation and modeling techniques.”

“AWS is committed to providing a seamless platform for the engineering community that has historically been challenged to do more with less while dealing with reduced product release cycles,” said Terry Wise, Vice President of Worldwide Partner Ecosystem, Amazon Web Services, Inc. “Through collaboration with Altair and Intel, the High-Performance Computing Cloud Challenge marks a significant opportunity for engineers to get hands-on experience with the AWS Cloud and transform their experience with CAE’s rich toolset.”

Proposals will be accepted through September 30, 2015.

For more information, visit:

Published in Altair

Intel Corporation today announced plans to invest more than $5 billion to build a new chip manufacturing facility at its site in Chandler, Ariz. The announcement was made by Intel President and CEO Paul Otellini during a visit by President Barack Obama at an Intel facility in Hillsboro, Ore.

The new Arizona factory, designated Fab 42, will be the most advanced, high-volume semiconductor manufacturing facility in the world. Construction of the new fab is expected to begin in the middle of this year and is expected to be completed in 2013.

“The investment positions our manufacturing network for future growth,” said Brian Krzanich, senior vice president and general manager, Manufacturing and Supply Chain. “This fab will begin operations on a process that will allow us to create transistors with a minimum feature size of 14 nanometers. For Intel, manufacturing serves as the underpinning for our business and allows us to provide customers and consumers with leading-edge products in high volume. The unmatched scope and scale of our investments in manufacturing help Intel maintain industry leadership and drives innovation.”

While more than three-fourths of Intel’s sales come from outside of the United States, Intel manufactures three-fourths of its microprocessors in the United States. The addition of this new fab will increase the company’s American manufacturing capability significantly.

Building the new fab on the leading-edge 14-nanometer process enables Intel to manufacture more powerful and efficient computer chips. The nanometer specification refers to the minimum dimensions of transistor technology. A nanometer is one-billionth of a meter or the size one ninety-thousandth the width of an average human hair.

“The products based on these leading-edge chips will give consumers unprecedented levels of performance and power efficiency across a range of computing devices from high-end servers to ultra-sleek portable devices,” said Krzanich.

Fab 42 will be built as a 300mm factory, which refers to the size of the wafers that contain the computer chips. The project will create thousands of construction and permanent manufacturing jobs at Intel’s Arizona site.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at

Published in Intel

Cray Inc. (Nasdaq: CRAY), Intel Corporation (Nasdaq: INTC), and Swift Engineering have been collectively recognized in the annual HPCwire Readers’ and Editors’ Choice Awards for “Best Use of HPC in Automotive.”

Swift is a product development company that designs and builds innovative products from race cars to jet planes. The Company uses the Cray CX1 and Cray CX1000 high performance computing systems, powered by 18 dual-socket Intel® Xeon® processors 5600 series, to reduce time-to-market with proven aerodynamic solutions and the aid of Computational Fluid Dynamics (CFD).

“Cray’s powerful CX1 and CX1000 systems allowed Swift to develop our unique Mushroom Buster™ aerodynamic race car design,” said Jan Wesley Refsdal, Swift’s president. “A Mushroom Buster equipped race car sweeps up the turbulent wake behind the car, promoting closer and more thrilling racing. Cray and Intel’s affordable HPC solution has given a small company like Swift the ability to prove such a revolutionary concept for our Formula Nippon race cars with 640 BHP, reaching speeds of 200 MPH in a safe virtual environment.”

Swift upgraded to a true HPC system earlier this year after running CFD on a small cluster since 2003, and has increased its capability 10 to 100 times, depending on the problem. “We aren’t just doing the same things faster,” said Mark Page, Swift’s chief scientist, “we’re doing many more things now that we haven’t had the ability to do before.”

“The acknowledgement from the readers and editors of HPCwire is a real honor, and we are proud of the fact that our first-ever Cray CX1000 customer has received this award,” said Barry Bolding, vice president of Cray’s products division. “Cray provides a full range of HPC systems to meet the needs of the automotive and aerospace markets, and Swift’s development of its innovative Mushroom Buster design is a great example of pushing the boundaries of automotive engineering through the combination of CFD, Intel processors and Cray supercomputers. We launched the Cray CX1000 with Swift and it is an honor to be working with such an innovative company.”

“Together with Cray, Intel is proud to enable Swift’s engineers to develop innovative and exciting designs,” said Rajeeb Hazra, general manager of High Performance Computing at Intel. “By combining the power of Intel Xeon processors 5600 series with Cray’s high-performance computing systems, we can help Swift test new concepts more rapidly and safely, bringing increased performance and excitement to motorsports.”

The award was presented at the 2010 International Conference for High Performance Computing, Networking, Storage and Analysis (SC10), in New Orleans, Louisiana. The list of winners was revealed at the HPCwire booth at the event, and on the HPCwire website, located at

The coveted HPCwire Readers’ and Editors’ Choice Awards are determined by online polling of the global HPCwire audience followed by a rigorous selection process involving HPCwire editors and industry luminaries. The awards are an annual feature of the publication and constitute prestigious recognition from the HPC community. They are revealed each year to kick off the SC10 conference, which showcases high performance computing, networking, storage, and data analysis solutions."HPCwire readers are among the most informed in the HPC community and these awards highlight the HPC-related companies that are making the biggest impacts in mind-share within this community,” said Tom Tabor, publisher of HPCwire. "The HPCwire Readers’ and Editors’ Choice Awards send a strong message to the recipients that those in the global HPC community recognize their work, and consider their efforts meritorious. Our congratulations go out to all the winners.” More information on these awards can be found at the HPCwire website (

About HPCwire
Published by Tabor Communications, HPCwire is the most recognized and accessed news and information site covering the entire ecosystem of High Productivity Computing (HPC). HPCwire is the publication of choice for the global community of business and technology professionals interested in computationally- and data-intensive computing, including infrastructure topics such as software, middleware, hardware, networking, storage, tools and applications. HPCwire can be found online at

About Cray
As a global leader in supercomputing, Cray provides highly advanced supercomputers and world-class services and support to government, industry and academia. Cray technology is designed to enable scientists and engineers to achieve remarkable breakthroughs by accelerating performance, improving efficiency and extending the capabilities of their most demanding applications. Cray’s Adaptive Supercomputing vision is focused on delivering innovative next-generation products that integrate diverse processing technologies into a unified architecture, allowing customers to surpass today’s limitations and meeting the market’s continued demand for realized performance. Go to for more information. Cray is a registered trademark of Cray Inc. in the United States and other countries, and Cray CX1 and Cray CX1000 are trademarks of Cray Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at and Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

Published in Swift Engineering

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