Seco Tools Participating in DMG/Mori Seiki Innovation Days

Seco has announced that it will be participating in DMG/Mori Seiki’s Innovation Days on May 3 – 5 at the DMG/Mori Seiki’s US headquarters in Hoffman Estates, Illinois. Seco will be providing tooling for a variety of innovative cutting demonstrations and demonstrating the use of a broaching operation for blisk machining. The company will also participate in a demonstration incorporating simultaneous upper and lower turret machining to produce fins for the aerospace industry.

“The market continues to grow more competitive and manufacturers need solutions designed for the unique requirements of the industries they serve,” says Mike Herman, OEM Technical Specialist at Seco. “Seco embraces working together with machine tool builders to develop industry-specific products and processes that achieve cost savings and productivity enhancements.”

Among the demonstrations at Innovations Days, Seco will be providing custom tooling for a newly developed broaching application used for blisk machining. In addition to highlighting an innovative cutting process,this application will also showcase the capabilities of the new NTX Series from DMG/Mori Seiki. Seco will also participate in a demonstration showing how opposing cutters can be used in a pinch milling application to machine a blade for the power generation industry.

Seco personnel will be available at Innovation Days, to discuss their latest product introductions and technological innovations. Manufacturers can register for DMG/Mori Seiki’s Innovation Days at http://www.cvent.com/events/innovation-days-2011/event-summary-b88e33d576fe47979c5364335eb4e887.aspx

For more information visit: www.secotools.com

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