Longview Advisors

Longview Advisors (13)

Tuesday, 15 September 2015 15:11

2015 3D Collaboration & Interoperability Congress

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Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC), is proud to announce the agenda is complete for their 2015 event, to be held October 28-29 at the Marriott Westfields at the Dulles Airport in Washington DC. CIC 2015 will be co-located with CIMdata’s highly-regarded PLM Road Map for the Aerospace & Defense Community. The theme of this year’s CIC event is “Enabling MBE in Enterprise PLM”. Longview Advisors is co-producing CIC 2015 with Jennifer Herron of Action Engineering.

This year’s CIC will be focused on the Aerospace and Defense industry, but remains, as always, highly pertinent to mechanical and systems engineers in the Aerospace, Defense, Automotive, Medical, Industrial Equipment and other discrete manufacturing industries. CIC is the only vendor-neutral event addressing collaboration and interoperability in manufacturing and business communications. CIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing.

PLM Road Map 2015 for the Aerospace & Defense (A&D) Industry featuring 3D CIC is the must-attend event for A&D industry executives and PLM practitioners globally; providing independent education and a collaborative networking environment where ideas, trends, experiences, and relationships critical to the A&D industry germinate and take root.

The first day of the event will focus on 3D Model-Based Design (MBD) for Product Definition, with emphasis on advanced features, data retention, and compliance. The second day will focus on Enabling a Model-Based Enterprise (MBE) with emphasis on the MBD/MBE vision, downstream integration, standards in MBD/MBE, quality, and inspection.

Attendees will be able to take advantage of over 25 presentations covering topics such as:

  • Digital Product Definition & Why Standards Matter
  • Influencing Standards for Data Storage & Exchange
  • 3D Model-Based Design for Aircraft Type Certification, an OEM’s Viewpoint
  • High Volume Real Time Global Collaboration & ITAR Compliance on an International Strategic Weapons Program
  • 3D Model-Based Definition at Embraer
  • Complementing Complex PLM Systems with Simplified User Interfaces
  • Long Term Archiving and Retrieval of Digital Product & Technical Data (LOTAR)
  • Enabling System-of-Systems PLM with Digital Thread Support: From Design to Manufacturing, Inspection & Beyond
  • Communicating a New Way of Doing Business – 3D PDFs the Boeing Way
  • Exploring the Advantages of the 3D Product Model to Build Ships
  • Classic Mistakes in MBD – How they can Impact Early Benefits
  • How do you rate in MBE?
  • What Does MBD look like for Organic Engineering in the U.S. Navy?
  • Building the Ship Before the Ship is Built
  • ASME Y14 Digital Product Definition Standards Enable MBE and MBD
  • Quality Information Framework, The Missing Standard for Quality & Inspection
  • The Impact of Standards-Based Interoperability (STEP AP242 and PMI) to enable the Supply Chain
  • The MBD Value Stream – Capabilities & Value Proposition
  • The Platformization of PLM


For more information, visit: www.3DCIC.com

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3D CIC), announced a keynote speaker for its 2014 event.

Allan Behrens, founder of leading Industry Analyst firm, Taxal, will present “Improving Collaboration through More Effective Systems Engineering in Complex Product Design, Development, Manufacturing and Test.” Allan will discuss Systems Engineering and the opportunity to use it as a principle and process to deliver better product and operational success in complex manufacturing industries. Allan has been party to and commentator on multi-disciplinary (Mechanical, Software and Electronic) product development for over 30 years. He is responsible for research, thought leadership and business insights on manufacturing companies at Taxal, an Industry Analyst and Consulting organization that provides analysis, advisory, research and business services for companies looking to increase revenues and profitability.

3DCIC 2014 will be held May 28-30 at the Cheyenne Mountain Conference Resort in Colorado Springs, Colorado.

3DCIC is dedicated to fostering and improving collaboration and interoperability throughout the product lifecycle. Now in its eleventh year, 3DCIC is the only vendorneutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from a broad array of commercial and defense industries, as well as with representatives from government. 3DCIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing.

Organizers are pleased to announce that NAFEMS (the International Association of the Engineering Modeling, Analysis and Simulation Community is holding their biennial American conference in conjunction with 3DCIC 2014. In addition, the PDES Board of Directors will again hold their annual meeting at 3DCIC and the 3D PDF consortium will be joining again for its third annual meeting.

Registration is open on the web site. Interested attendees are encouraged to register soon as time-limited discounts currently apply.

Longview Advisors also is pleased to announce that free, open access to all presentations from past events is now available on the event website.

For more information, visit: www.3dcic.com

Wednesday, 13 November 2013 11:19

2014 3D Collaboration & Interoperability Congress

Written by

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC), is proud to announce its 2014 event, which will be held May 28-30 at the Cheyenne Mountain Conference Center in Colorado Springs, Colorado.

3DCIC is dedicated to fostering and improving collaboration and interoperability throughout the product lifecycle. Now in its eleventh year, 3DCIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from a broad array of commercial and defense industries, as well as with representatives from government. 3DCIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing.

Organizers are pleased to announce that NAFEMS (the International Association of the Engineering Modeling, Analysis and Simulation Community is holding their biennial American conference in conjunction with 3DCIC 2014. In addition, the PDES Board of Directors will again hold their annual meeting at 3DCIC and the 3D PDF consortium will be joining again for its third annual meeting.

“For decades, executives have understood that the seamless integration of design, analysis/simulation, manufacturing, downstream operations and the supply chain is the key to effective global business. It’s the core of the PLM vision,” explains David Prawel, president of Longview Advisors and program chair of the congress. “Making this work requires highly trained people, sharing information in efficient processes, supported by world-class technology. This is what 3DCIC is all about.”

“Engineering simulation continues to increase its penetration in to all aspects of the product lifecycle,” commented Tim Morris, NAFEMS CEO. “Integration with systems engineering and the use of multi-disciplinary technologies are gaining pace. At the same time, OEMs now delegate more engineering, and hence simulation, to suppliers. Systems level requirements must be cascaded down the supply chain, and simulation results delivered back up to systems integrators. The need for understanding of interoperability and collaboration issues is paramount. Aligning the NAFEMS and 3DCIC conferences will provide attendees with an unparalleled opportunity to explore, debate, discuss and understand these topics.”

For more information or to register, visit: www.3DCIC.com

Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its keynote speaker for its 2013 event; to be held May 21-23, 2013 in Colorado Springs, Colorado.

Tom Soderstrom, CTO in the Jet Propulsion Laboratory’s Office of the CIO, will present "Collaborating to Put Wheels on Mars.” Soderstrom will discuss the tremendous amount of innovation that was involved in the development and landing of the NASA Mars Science Laboratory (MSL), and the intense collaboration, interoperability and coordination in JPL’s IT systems and organizations. He will also discuss how these innovations, lessons learned and implications impact the future of collaboration and interoperability. As IT CTO at the JPL, Soderstrom leads a collaborative, practical, hands-on approach with JPL and the industry to investigate and infuse emerging IT technology trends that are relevant to JPL, NASA and large enterprises.

Now in its tenth year, CIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from many sectors of discrete manufacturing, including automotive, aerospace, heavy equipment and electronics industries, as well as with representatives from government and defense communities.

Conference organizers are pleased to announce that NASA/ESA (European Space Agency) is merging with CIC and will hold its14th annual product data exchange meeting at CIC 2013 and thereafter. In addition, the PDES Board of Directors will again hold its annual meeting at CIC this year, and the 3D PDF consortium will be holding its second annual meeting at CIC 2013.

Interested attendees are encouraged to register soon as time-limited discounts currently apply.

Longview Advisors also is pleased to announce that free, open access to all presentations from past events are now available.

For more information, visit: www.3DCIC.com

Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today opened its call for speakers for the 2013 event to be held May 21 to 23 in Denver, Colorado.

CIC is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing. Now in its tenth year, CIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from many sectors of discrete manufacturing, including automotive, aerospace, heavy equipment and electronics industries, as well as with representatives from government and defense communities. Visit the website (www.3DCIC.com) to register or learn more about the event.

Conference organizers are pleased to announce that NASA/ESA (European Space Agency) is merging with CIC and will hold its14th annual product data exchange meeting at CIC 2013 and thereafter. In addition, the PDES Board of Directors will again hold its annual meeting at CIC this year, and the 3D PDF consortium will be holding its second annual meeting at CIC 2013.

Conference organizers are looking for presentations from product designers, engineers, IT professionals or supply chain/downstream experts which focus on strategies, trade-offs and/or implementation case stories of real-world solutions in the following areas:

  • Building collaborative PLM into the global supply chain, including such topics as change order management, intellectual property security and management
  • Digital product data deployment beyond engineering
  • Leveraging social media within companies and with suppliers
  • Design-analysis/simulation collaboration
  • Design for manufacture, and design-manufacturing collaboration
  • PLM migration and legacy data management

Anyone interested in speaking at the event should email speaker name, title and role, and a few sentences description of the proposed presentation topic to David Prawel at Longview Advisors ( This e-mail address is being protected from spambots. You need JavaScript enabled to view it ) by December 30, 2012.

Longview Advisors is pleased to announce that free access to all presentations and audios from previous CIC events, are now available.

For more information, visit: www.3DCIC.com

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC), is proud to announce its 2013 event, which will be held May 21-23 at the Cheyenne Mountain Conference Center in Colorado Springs, Colorado.

3DCIC is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing.

Now in its tenth year, CIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from automotive, aerospace, heavy equipment, electronics industries, as well as with representatives from government and defense communities. 3DCIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing.

Organizers are pleased to announce that NASA/ESA (European Space Agency) is merging with 3DCIC and will hold their 14th annual product data meeting at 3DCIC in 2013 and thereafter.

“Collaboration and interoperability present some of the toughest impediments to improving manufacturing competitiveness,” explains David Prawel, president of Longview Advisors and program chair of the congress. “It’s about people working together to build better products faster, with higher quality – topics squarely in our sights at 3DCIC.”

For anyone interested in viewing presentations and audio from past events, all content is now freely available

For more information, visit: www.3DCIC.com

Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its lineup of speakers for this year's event.

The 3D Collaboration & Interoperability Congress is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing.  Now in its ninth year, the annual Congress is the only vendor- and product-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The international event has grown into an essential forum for executives, managers, senior engineers and IT professionals to network, learn and strategize with thought leaders from automotive, aerospace and many other manufacturing industries, as well as with representatives from government and defense communities.

The 2012 CIC program is highlighted by the following information-packed presentations and panels of industry experts:

  • Lessons Learned in over 40 years in Aerospace and Defense, Jack Harris, Vice Chairman, Iowa Innovation Council, Chairman, Iowa Advanced Manufacturing Council and Rockwell Collins, Director, Advanced Manufacturing Technology, Retired
  • Leveraging Virtual Engineering Environments to Drive Margin Improvement AND Product Development Flexibility, Eli Wieskamp, Chief Engineer, United Rotocraft - An Air Methods Division, and David Fedler, Founder, Summit of Everest Group
  • Aerospace and defense: Global interoperability across the supply network for life, Howard Mason, Corporate Information Standards Manager, Office of the CIO, BAE Systems
  • Democratizing 3D: Leveraging Product Data Assets Beyond Design Engineering,  Lars Peder Hansen, Senior Systems Consultant - CAD/PLM, Grundfos Group, Denmark
  • Manufacturing & PLM in 2020, Stephen Bodnar, VP Manufacturing Solutions, Autodesk, Inc.
  • 3D based process plans on 787, Leveraging Model Based Definition for Manufacturing, Max Jensen, Senior Developer, ME Systems Development, Boeing
  • Driving High Volume and High Quality in a Huge, Globally Inter-Connected Automotive Supply Chain, Rahim Alsaffar, Lead Engineering Specialist at Johnson Controls Automotive Group
  • How PMI and Data Modeling Standards Affect Successful Implementation of 3D MBD and MBE, Bryan Fischer, President, Advanced Dimensional Management
  • An update on LOTAR for Long Term Archival and Retrieval of Digital Design and PDM data, Richard Zuray, Technical Principal - CAD/CAM/CAI and Quality Engineering, The Boeing Company
  • The Impact of Social Networks on PLM and Global Supply Chains, Chad Jackson, President and Founder of Lifecycle Insights
  • Incorporating Equipment Information into New Facility Construction and Retrofits, Jason Hosch, Senior Industrial Engineer, Intel
  • Downstream Supplier Challenges within MBE, Ric Norton, Program Manager and Technical Data Analyst for the Defense Logistics Agency (DLA) Logistics Information Service
  • Leveraging the rise of the social consumer for new product innovation, Rob Fisher, Director of Marketing, Madison Electric Products
  • A Comparison of Light-Weight 3D Formats, Peter Pfalzgraf, Director Product Center PDFGEN3D, PROSTEP AG
  • Data Distribution on the 787, Bringing Model Based Definition to the World, David Briggs, Associate Technical Fellow -787 Engineering Information Delivery, The Boeing Company
  • Successfully engaging Small and Medium Enterprises (SMEs), Dr. Nathan Hartman, Assistant Department Head, Department of Computer Graphics Technology, Purdue University; Philip Rosche, Senior Associate, ICF International; Kevin Fischer, Advanced Manufacturing Technology, Rockwell Collins
  • Model Based Enterprise Impact on Organizational Behavior, James DeLaPorte, Partner and Business Transformation Leader, NexTec
  • 3D in Heavy Construction at Shimazu, Sakiko Seki, Business Development Manager, Smartscape, Inc., Japan
  • How does the small and large supplier support MBE standards?, Rich Eckenrode, President, Recon Services
  • PDM/PLM Validation Handbook, Roy Wittenburg, Project Manager for UTRS, US Army
  • CAx-IF -- Supporting STEP development for Collaboration and Interoperability, Philip Rosche, Senior Associate with ICF International, STEP CAx Implementors Forum
  • PLM Vendor Panel, hosted by David Prawel with Four PLM Vendor Panelists
  • Design, Development, and Testing of an Open Standards-Based Simulation Data Management and Archival System, Keith Hunten, Senior Staff Aerospace Engineer, Lockheed Martin Aeronautics Company
  • Using 3D to visualize concepts in business-analytic landscapes, Robb Bush, Technology and Innovation Marketing , Global Center of Excellence, SAP

To find out more about the event and for free access to presentations and audios from past events, visit: www.3dcic.com

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress, announced the 3D PDF Consortium will hold its first annual meeting in conjunction with the 3DCIC on the afternoon of Wednesday, May 23, 2012. The 3DCIC is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing. The 3D PDF Consortium also is sponsoring the popular industry forum.

"3DCIC is a natural fit for our annual meeting," says David Opsahl, the Consortium executive director. "The Congress focuses on end user experiences across any industry, and how users are meeting their objectives by leveraging product data assets in ways that generate real return on investment. This is very appealing to our members. They gain valuable insights on innovative ways their manufacturing colleagues are addressing some of the same challenges they themselves face."

The 3D PDF Consortium is a community of companies interested in collaboration of dynamic 3D data through PDF files. Software providers, systems integrators, government agencies, and businesses that provide and consume 3D data solutions look to the 3D PDF Consortium to demonstrate the success of these solutions within the market and promote 3D PDF as a solution to improve business results. The 3D PDF Consortium promotes 3D PDF adoption through demonstrating best practices and generating awareness of the power of 3D-enabled PDF to solve a multitude of communication and collaboration challenges across various industries.

The 3D Collaboration & Interoperability Congress is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing.  Now in its ninth year, the annual Congress is the only vendor- and product-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The international event has grown into an essential forum for executives, managers, senior engineers, and IT professionals to network, learn and strategize with thought leaders from automotive, aerospace and many other manufacturing industries, as well as with representatives from government and defense communities.

For more information, visit: www.3DPDFConsortium.org or www.3dcic.com

Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), announced today its keynote speakers for its 2012 event to be held May 21-23 in Denver, Colorado.

Now in its ninth year, CIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from automotive, aerospace, heavy equipment, electronics industries, as well as with representatives from government and defense communities.

Jack Harris, recently retired Director of Advanced Manufacturing Technology at Rockwell Collins, will share "Lessons Learned in over 40 years in Aerospace and Defense." With more than 40 years at Rockwell Collins, Jack held numerous leadership positions in engineering, advanced technology, programs and operations. Jack currently serves as General Manager of the PDES Inc. consortia.

Rahim Alsaffar, Lead Engineering Specialist at Johnson Controls Automotive Group, will present "Driving High Volume and High Quality in a Huge, Globally Inter-Connected Automotive Supply Chain." Mr. Alsaffar will discuss how collaboration technology, people and processes help deliver high-volume products at the lowest cost in the shortest time, with unrivaled quality. Rahim has more than 15 years of combined product development and product design operations experience, with a recent focus on leveraging technology to improve quality.

Chad Jackson, President of Lifecycle Insights and author of the popular Engineering Matters newsletter, will present "The Impact of Social Networks on PLM and Global Supply Chains." Mr. Jackson is a recognized authority on design and engineering in new product development and introduction with more than 15 years of experience in the industry. Before founding Lifecycle Insights, Chad led the Product Innovation and Engineering practice for Aberdeen Consulting, as Vice President and Principal Analyst. Prior to Aberdeen, Chad held a number of roles at an engineering software provider for more than a decade.

Longview Advisors also is pleased to announce that free, open access to all presentations from past events is now available at: www.3DCIC.com

Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), is proud to announce the 2012 event, which will be held May 21-23 in Denver, Colo. CIC is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing.

Now in its ninth year, CIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from automotive, aerospace, heavy equipment, electronics industries, as well as with representatives from government and defense communities.

"The global business of product design, development and manufacturing is all about people working together to build better products faster, with higher quality," explains David Prawel, president of Longview Advisors and program chair of the congress. "CIC addresses this mission-critical topic from all angles. It has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing."

"CIC provides great value for us at Parker Hannifin. It hits critical timely issues and is vendor/product neutral, so it gives us an unbiased perspective to help guide our long-term collaboration and interoperability strategies," says Bob Deragisch, Manager, Enterprise Systems at Parker. "Parker has been well represented, and we intend to continue a strong presence there. The networking is excellent, due to a combination of great venues, exclusive audience and highly experienced, senior participants."

For anyone interested in reviewing presentations and audio from past events, all content from the most recent four year's events is now available at: www.3DCIC.com

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced the corporate underwriters of this year's event.

Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systemes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek, mental images, Noble Tek, Parametric Technology Corp., 3D PDF Consortium, Right Hemisphere, Spatial, Tetra 4D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.

"Autodesk is proud to support this year's Collaboration and Interoperability Congress," according to Robert "Buzz" Kross, senior vice president, Manufacturing Industry Group at Autodesk. "The CIC event is truly unique. It brings together the best and brightest from across the manufacturing industry to address some of the most difficult customer challenges."

"We want to publically acknowledge the generosity of our sponsors who make this gathering possible -- and make it better -- every year," says David Prawel, president of Longview Advisors. "Our list of sponsors is an impressive assembly of the industry leaders in collaboration and interoperability, who each year provide guiding light into the keys to innovation."

Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.

Visit the website (www.3dcic.com) to find out more about the event, and for free access to all presentations and audios from the 2010, 2009 and 2008 events.

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced a new, special forum for executive management in conjunction with the 2011 event, to be held May 23 to 25 in Denver, Colorado. The new Management Forum will cover topics of particular interest to executives managing processes and people for more effective global collaboration in product development and manufacturing. The following topics are currently on the agenda for this year’s forum:

* Teamwork, Social Computing and Their Impact on Simulation Driven Design?
* Managing the Braindrain Threat from Boomer Retirement
* Irreconcilable Differences? Getting Engineers from Different Generations To Work Together
* Mashups: A Killer App for Engineers?
* Is PDM-Less PLM Pragmatic or Problematic?

This first year’s Management Forum will be hosted by Chad Jackson, a recognized authority on design and engineering in new product development, with more than 15 years of experience in the industry. “I'm excited to host the new Management Forum at CIC,” said Jackson, president of Lifecycle Insights Inc. “There are a lot of issues that are mission-critical to executives managing organizational performance. Our new forum is targeted squarely at these types of issues.”

Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.

Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systèmes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek, Mecanica Solutions, mental images, Parametric Technology Corp., Right Hemisphere, Spatial, Technigraphics, Techsoft 3D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.

Visit the web site www.3dcic.com to find out more about the event, what past attendees had to say, and why you should attend, and for free access to all presentations and audios from the 2010, 2009 and 2008 events.

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced that registration is open for the 2011 event to be held May 23 to 25 in Denver, Colorado. Software, engineering, manufacturing and IT professionals are welcome to register at www.3dcic.com. Time-limited early registration discounts currently apply.

Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.

This year's agenda includes a keynote address by Dick Morley, father of the Programmable Logic Controller (PLC), inventor of the floppy disk, venture capitalist, and renowned speaker and author, along with featured general session speakers, information-packed breakout tracks, and highly-interactive roundtable discussions with expert panelists, covering such topics as:

* Deploying PLM to Drive Collaboration Standards
* Incorporating STEP and Collaborative Data Formats in PLM
* PDM /PLM interoperability and migration
* Global Automotive Industry Initiatives for Standards Based Visualization Interoperability
* Digital Product Data Deployment Beyond Engineering
* Making 3D Product Data Cheap and Available with JT and STEP
* Managing Legacy Data
* CAD Vendor Collaboration & Interoperability Strategies
* Model Based Enterprise Definition and Infrastructure Update
* Enhancing Collaboration in Your Global Supply Chain
* OEM-Supplier Visualization Data Exchange
* Managing for Effective Collaboration in Global Product Development
* Collaboration in Network-Centric Manufacturing
* The Future of Open Source in PLM
* CAD Interoperability with Analysis/Simulation and Manufacturing
* Collaboration Technology & Implementation


Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systemes, Hewlett-Packard, Intel, ITI TranscenData, mental images, Parametric Technology Corp., Right Hemisphere, Spatial, Technigraphics, Techsoft 3D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.

Visit the web site www.3dcic.com to find out more about the event, what past attendees had to say, and why you should attend, and for free access to all presentations and audios from the 2010, 2009 and 2008 events.

About Longview Advisors

Longview Advisors Inc. provides consulting services in the business, technology and application of 3D software in product lifecycle management. For more information, please visit:   www.longviewadvisors.com

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