IPC

IPC (31)

Monday, 20 January 2014 11:56

Exhibit Space Sold Out For 2014 IPC APEX EXPO

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IPC — Association Connecting Electronics Industries® announced that all 135,000 sq. ft. of exhibit floor space has sold out for IPC APEX EXPO® 2014, making it the largest IPC APEX EPO in the last five years. The technical conference and exhibition will take place March 25–27, 2014, at the Mandalay Bay Resort and Convention Center in Las Vegas.

To visitors, the sold-out status means that the show floor will be busy and informative, with more than 425 exhibitors introducing new product technologies, innovations and demonstrations of the industry's newest advancements, many of which will also be highlighted in the dedicated New Product Corridor on the show floor. Top-rated suppliers will present best-in-class equipment, materials, processes and services to help attendees gain greater efficiency while improving their bottom lines.

"One of the top objectives for attendees is to see new products on the show floor. IPC APEX EXPO has been recognized as the 'best show to do business,' and provides ample opportunities to network with existing customers, meet new customers, grow business and increase revenue," said Alicia Balonek, senior director of trade shows and events.

Exhibits-Only registration is free to individuals who pre-register online ($35 on-site). To maximize event experience, individuals can take advantage of the All-Access Package which includes the technical conference; professional development courses; standards development meetings, IPC luncheons and more.

Exhibit hours are Tuesday, March 25 and Wednesday, March 26 from 10 am - 6 pm and Thursday, March 27 from 10 am - 2 pm.

For more information, visit: www.IPCAPEXEXPO.org/exhibitors

Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO® Technical Conference on February 19-21, 2013, at the San Diego Convention Center, will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

“Conference attendees this year will find a lot of sessions that pertain directly to issues and concerns with production on the factory floor,” says IPC Technical Conference Director Greg Munie, Ph.D. “We have sessions covering defects like pad cratering and head on pillow; voiding; bare board testing and reliability; and rework for high-reliability assemblies. The information presented will reveal new paths and solutions for companies to take.”

Over three days, 35 technical sessions with nearly 100 research papers will address additional topics such as military electronics, advanced packaging, fluxes and paste, embedded devices, high-frequency electronics and electrostatic discharge. In addition, the areas of rework/repair, cleaning, assembly reliability, solder and alloy reliability, printing and printed electronics will have multiple sessions due to the wealth of information available.

“Printed electronics remains a growing and soon-to-be ubiquitous technology. One of the great benefits of the technical conference is the opportunity to network, ask questions and get answers to challenges across the supply chain,” Munie adds.

For more information, visit: www.IPCAPEXEXPO.org/conference

Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.

Covering issues in design, lead-free technology, materials, process improvement, solder joint reliability and more, the courses will go beyond theory to provide practical solutions to industry issues and challenges. Each course is led by a subject-matter expert, runs for three hours and will include an instruction handbook.

Industry experts such as Mike Carano of OMG, Happy Holden of Gentex, Cheryl Tulkoff of DfR, Bob Wetterman of BEST and Phil Zarrow of ITM will offer one or more courses.

Course highlights include:

  • Design for Manufacturing (DFM): Best Practices (PD08)
  • Extreme HDI: Designing for Maximum Density (PD10)
  • Best Practices in Electronics Assembly Processes (PD13 and  17)
  • Tin Whiskers: Failure Risk and Mitigation Strategies (PD21)
  • Ball Grid Array: Principle and Practice (PD30)
  • Package on Package: Design, Assembly, Rework and Inspection (PD44)

“The courses at IPC APEX EXPO will enable engineering and management staff to work smarter in an era of increasing product sophistication,” says Susan Filz, IPC director of industry programs. “Attendees will bring home new insights and solutions to boost their productivity.”

Engineers like Rigo Garcia, Sr. Quality Assurance Engineer, NASA Goddard Space Flight Center agree, “The conference and courses offer a great opportunity to increase my value as a professional … and having the chance to talk to the technical experts and see equipment being used today is incredibly valuable.”

Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by January 25 will save 20 percent off registration fees. A new registration option for 2013, the Maximum Value Package (MVP) includes a choice of up to six half-days of professional development, all technical conference sessions, standards development meetings, luncheons and more — all with a savings of more than 75 percent over individual item prices.

For more information or to register, visit: www.IPCAPEXEXPO.org/courses

Thursday, 25 October 2012 11:29

IPC APEX EXPO® 2013

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Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center.

Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.

“Results from the technical papers presented allow us to get to solutions faster, reduce our internal experimentation and make connections with experts that are great resources for future projects,” said Julie Silk, technical program manager, Agilent Technologies. “By talking face-to-face with engineers working on similar challenges, we make progress on reaching industry-wide solutions that benefit all of us.”

In addition, IPC APEX EXPO features many free activities, including technical BUZZ sessions, poster presentations, keynotes on a vision of life in the future and an inside look at the Curiosity rover mission, networking opportunities and new this year, a Printed Board Assembly Cleaning & Contamination Center that will be on the show floor. Also on the exhibition floor, the highly popular New Products Corridor and the IPC APEX EXPO Hand Soldering Competition will again be featured. In 2013, IPC APEX EXPO will also welcome hand soldering champions from around the world as it hosts the IPC Hand Soldering World Championship on February 21.

To help attendees plan their itineraries for the show and to focus in on the products and services of most interest to them, IPC offers My APEX EXPO, an online interactive planner that enables users to effectively and efficiently make appointments with exhibitors and schedule their time at the show. My APEX EXPO allows users to view the more than 400 exhibiting companies on the show floor, read up on exhibitors’ products and services and even communicate with exhibitors and colleagues in advance of the show.

Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by January 25 will save 20 percent off registration fees. A new registration option for 2013, the Maximum Value Package (MVP), offers a savings of more that 75 percent over individual item prices.

Recognized as one of Trade Show News Network’s top 25 fastest-growing trade shows in the U.S., IPC APEX EXPO has added four more hotels to its list of official hotels to help meet the growing demand. Special IPC-negotiated hotel rates, through IPC’s official housing service Experient, are available until January 28, 2013. In addition to offering the opportunity to Book Now, Pay Later, Experient offers the lowest rates, the ability to waitlist, outstanding customer service and dedicated housing specialists.

For more information, visit: www.IPCAPEXEXPO.org

To keep the momentum of the dramatic revolution in technology and functionality of today’s electronic products, technologists must find new ways of facing the age-old problem of lighter, faster and less expensive. Bringing together the entire electronics industry — from printed board materials to component packaging and semiconductor design to complete systems — the inaugural IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.

Tracks for the conference and professional development courses will include: product design and development; assembly and SMT; PCB fabrication, materials and design; quality and reliability; fabrication and silicon; test; equipment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; and industry analysis and issues.

“The program will include data-driven, high-quality papers, panel discussions, professional development courses and keynote speakers,” says Senol Pekin, Ph.D., Intel Corporation, and general chair of the event. “We have been working hard to establish a well-credentialed program committee of more than 50 experienced technology professionals from across the industry. They will bring excellent technical experience to evaluating the papers and creating a program that has both depth and breadth.”

The deadline for abstract and proposal submission is November 5, 2012.

The exhibition will bring together companies that supply to all levels of the systems technology supply chain in a 24,000 sq. ft. column-free exhibition hall. It is a unique opportunity to reach product specifiers and manufacturing visionaries working on tomorrow’s vital electronic products.

For more information, visit: www.ipc.org/ESTC

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, February 19–21, 2013, at the San Diego Convention Center, San Diego, California. Poster presentations offer profile-raising exposure to key engineers, managers and executives attending the show.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment. Submissions in the areas of printed electronics, packaging and components, surface finishes, reliability and lead-free assembly are especially encouraged. An abstract of up to 300 words summarizing technical and previously unpublished, noncommercial work covering case histories, research and discoveries should be submitted by November 23, 2012.

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

For more information, visit: www.IPCAPEXEXPO.org/CFPosters

Thursday, 05 July 2012 10:29

2012 IPC Midwest Conference & Exhibition

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With more than 50 exhibitors and three-quarters of its show floor sold to date, IPC Midwest is geared up to deliver another very focused, regional event targeted solely to the electronics manufacturing industry. IPC Midwest Conference & Exhibition will be held August 22–23, 2012, at the Renaissance Schaumburg Convention Center, Schaumburg, Illinois.

“We’re on target with all the top suppliers — from capital equipment to materials. The full supply chain will be on the exhibit floor,” says Mary Mac Kinnon, IPC director of sales.

As Mac Kinnon explains, IPC Midwest is important to the vitality of the industry in the Midwest. “It provides a much needed venue for exhibitors to cost-effectively reach out to customers and likewise, for staff from EMS companies, PCB manufacturers and OEMs in the central region to conveniently search out new and profitable business relationships. These staff can also catch up on the latest industry advances and learn news ways to increase productivity and reliability of their electronic products.”

In its sixth year, IPC Midwest will continue to offer a technical conference in addition to the exhibition, and will host standards development meetings where industry leaders will convene to work on electronics manufacturing standards that are used and referenced around the world.

New this year, the IPC Executive Summit will be held in conjunction with IPC Midwest. According to Alicia Balonek, IPC director of trade shows, “it made sense to co-locate the two events so that senior-level executives could take advantage of the benefits of IPC Midwest while saving valuable time and travel expenses.”

A free exhibits-only registration to IPC Midwest provides free access to the exhibition; a free Opening Session on current and potential applications of nanotechnology in electronics manufacturing; and a free afternoon reception to introduce IPC’s new president and CEO John W. Mitchell.

Special registration packages provide comprehensive event opportunities. Individuals who register by July 20 can save 20 percent on registration fees.

For more information, visit: www.IPCMidwestShow.org

Over two days in August, the technical conference at IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics. IPC Midwest Conference & Exhibition will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center Hotel, in Schaumburg, Illinois.

“This conference is all about giving engineers processing tools and information to work smarter in an age of increasing sophistication of assembly packaging and soldering materials,” says John Perry, IPC technical conference manager. “We’ve selected subject-matter experts from around the globe that will provide companies with solutions and insights to help them boost productivity and reliability.”

On Wednesday, August 22, the morning session, “Reliability Challenges of Bottom Termination Components,” will cover how to effectively manage the complexities of BTCs — the reduction of conductor pitch, spacing and stand-off height. Papers will address cleaning challenges in an HDI world, the mitigation or elimination of pad cratering, and printing and assembly challenges of quad flat no-lead (QFN) devices.

The afternoon will host two sessions: one on advances in assembly coatings and alternatives and the second on advances in reliability testing. “Assembly Coatings and Alternatives” will reveal new coating materials that incorporate nanoparticle technology, address low-temperature curing processes utilizing transient phase liquid sintering technology, and provide valuable insights into converting to low VOC conformal coating materials.

In “Advances in Reliability Testing,” industry experts will discuss minimizing soldering defects. Papers on capillary ion chromatography, moisture diffusion in electronic packaging materials, and mitigation strategies for ensuring reliable ENIG solderability will help companies minimize product recalls.

On Thursday, August 23, the day will begin with a look at innovative assembly processes for improving yields, service life and reliability in “Application Processing for Solder Related Materials.” Later that morning, the focus will turn to “Assembly Process Soldering Materials,” which will provide valuable information to engineers looking to characterize lead-free solder alloys and maintain reliability in their soldering processes.

Special savings of 20 percent off the technical conference or other fee-based show events is available through July 20, 2012.

To register or for more information on all the activities taking place at IPC Midwest Conference & Exhibition, including standards development meetings as well as free events, such as the opening session on nanotechnology and electronics assembly and the exhibition, visit: www.IPCMidwestShow.org

The IPC Midwest Conference & Exhibition will be held August 22–23, 2012, at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, Illinois.  A valuable forum for education, business development and networking, IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.

IPC Midwest’s two-day exhibition will feature electronics manufacturing’s top suppliers to companies in advanced microelectronics, aerospace and military, automotive, medical and industrial equipment and devices, telecommunications and other industries. Admission to the exhibit floor is free to pre-registrants.

Some of the world’s leading experts will share the latest research on manufacturing defect-free, quality electronic products in the two-day technical conference. The paper sessions will address reliability challenges for bottom termination components; advances in reliability testing; new assembly coatings and alternatives; innovative assembly processes for improving yields, service life and reliability; and performance characteristics of assembly process soldering materials.

IPC Midwest will also host valuable standards development meetings. More than 75 volunteer groups will meet to discuss and develop industry standards in areas from assembly and joining, base materials and cleaning and coating to embedded devices, high speed/high frequency interconnections and testing.

In addition, this year’s special events include a free opening session on Nanotechnology and Electronics Assembly, a reception on Wednesday to meet IPC’s new President & CEO John W. Mitchell, and the second annual IPC Midwest Hand Soldering Competition.

“IPC Midwest is a unique opportunity to attend a comprehensive industry event in a convenient regional location,” said Alicia Balonek, IPC director of trade show operations. “All under one roof, participants can discover the latest advances in electronics manufacturing as well as shop and compare equipment and processes for their unique needs, saving them valuable time and travel expenses."

In addition to offering free exhibits-only registration, IPC Midwest has special registration packages that provide comprehensive educational opportunities. To view all registration options, visit www.IPCMidwestShow.org/register. Individuals who register by July 20 can save 20 percent on registration fees.

For more information, visit: www.IPCMidwestShow.org

IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® at the San Diego Convention Center in San Diego, California. The technical conference will be held February 19–21, 2013, and the professional development courses will be February 17–18 and February 21, 2013.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and the “Best International Paper” for authors from outside the United States.

Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions dealing with lead-free processing, repair and reliability, high-speed PCB laminates and new research in growing areas such as green technology and printed electronics are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by May 4, 2012. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of technical and/or appropriate test results.

In addition, course proposals are solicited from individuals interested in presenting half-day professional development courses on printed board design and manufacturing as well as electronics assembly processes and materials. Reimbursement for travel expenses and an honorarium are offered to course instructors.

Technical conference paper abstracts and course proposals are due May 4, 2012. To submit an abstract or proposal, visit: www.IPCAPEXEXPO.org/CFP

Monday, 02 April 2012 09:54

IPC Announces Spring 2012 Webinar Series

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Providing convenient and cost-effective staff development, IPC — Association Connecting Electronics Industries® announces its 2012 spring webinars for April, May and June. Each one-hour webinar is focused on technical challenges facing the electronics manufacturing industry, offering companies a great opportunity to bring IPC technical information to a large number of employees at one time.

The following webinars will run from 10:00 am to 11:00 am, Central time:

Chamber Profiling to Meet IPC-9701A
Russell Brush, Operations Engineering Specialist, Celestica
Wednesday, April 4

Tin Whiskers — A 2012 State of the Industry Assessment
Dave Hillman, Metallurgical Engineer, Rockwell Collins
Thursday, April 5
FREE

What’s New? IPC-AJ-820
Kris Roberson, Manager of Assembly Technologies, IPC
Wednesday, April 18

Beginner Level Course on X-ray Inspection
Bob Klenke, Principal Consultant, ITM Consulting Inc.
Thursday, April 19

Is Cleaning Critical to PoP Assemblies?
Umut Tosun, Application Technology Manager, ZESTRON America
Tuesday, May 8

PCB Prototyping: In-house v. Outsource
Josh Brown, Marketing Development Representative, LPKF Laser & Electronics
Thursday, May 10

Tax Reform — It's Coming. R&D Credit, Partnerships, C Corps … What Will the New Rates Look Like? What Credits and Deductions Will Survive?
Keith Smith, Director, and John Tanner, Vice Chairman, Prime Policy Group
Wednesday, May 23

Business Outlook for the Electronics Industry: Midyear Update
Sharon Starr, Director of Market Research, IPC
Wednesday, June 6

PCB Depaneling with Lasers: A Comparison of Laser to Traditional Depaneling Methods
Josh Brown, Marketing Development Representative, LPKF Laser & Electronics
Wednesday, June 13

With the exception of the Tin Whiskers webinar on April 5 which is free, the registration fee of $75 per login for IPC members covers as many employees as can fit comfortably in a company’s conference or training room. The registration fee for nonmembers is $100.

For more information or to register, visit: www.ipc.org/webinar-schedule

IPC – Association Connecting Electronics Industries® announces the appointment of John W. Mitchell as its new president and CEO, effective April 23, 2012.

Mitchell brings to IPC a wealth of experience in strategic and tactical planning, international alliances and joint ventures, engineering management, creation of intellectual property, product marketing and business negotiations. His background includes management of both nonprofit and electronics industry organizations such as Bose Corporation and Alpine Electronics of America, Inc. Most recently he served as the CEO of Golden Key International Honour Society, the world’s premier collegiate honor society, with more than 2 million members from more than 190 nations.

“John’s demonstrated abilities to work on a global basis, bring disparate groups together, set a vision and course for success, and achieve a common goal make him the ideal person to lead IPC,” says IPC Board Chairman Steve Pudles, president and CEO of Spectral Response, LLC.

Mitchell began his engineering career at General Electric Aerospace. In 1992, he joined Alpine Electronics and became a founding member of its research company which is credited for introducing navigation systems to the U.S. market. During his tenure at Alpine, he held several positions, including manager of software engineering and director of IT.

In 2003, Mitchell was recruited to Bose Corporation as the general manager and director of a new global business unit — Bose’s largest-ever product development initiative.

As IPC’s chief staff officer, Mitchell will lead the organization’s global operations and staff and will report to the IPC Board of Directors. Working with the Board, he will help develop, refine and implement the Board’s strategic vision and goals.

“I am extremely honored to join IPC and have the opportunity to serve its members,” says Mitchell. “As the premier association and standards developing organization in the electronics manufacturing industry, IPC is a global leader in not only the education, training and certification arenas, but also on business management and competitiveness issues such as science-based regulations, conflict metals and export control reform. I look forward to working with its Board, volunteers and staff in continuing the organization’s success.”

IPC achieved the highest number of members in its history in February 2012, reaching 3,276 companies and sites worldwide that comprise hundreds of thousands of employees. Mitchell will be responsible for continuing IPC’s growth while meeting the needs of diverse constituents around the world through local programs and advocacy.

Mitchell’s academic credentials include a doctorate in higher education management from University of Georgia; an M.B.A. from Pepperdine University and a B.S. in electrical and computer engineering from Brigham Young University. He is fluent in Japanese and is experienced in producing successful business results internationally.

Mitchell succeeds Denny McGuirk, who became president of SEMI after 12 years with IPC. Jim Herring, IPC’s interim president and CEO, will assist with the transition.

IPC is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its more than 3,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

For more information, visit: www.ipc.org

IPC —Association Connecting Electronics Industries® has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Illinois. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.

Expert presentations are being sought in the areas of:

  • Adhesives
  • Cleaning Materials
  • Conformal Coatings
  • Design for Manufacturability
  • Design for Reliability
  • Design for Test
  • Electronic Materials
  • Fluxes
  • Handling and Storage
  • ICT
  • Incoming Inspection
  • Interconnection Performance
  • Moisture Sensitivity
  • Optical/Laser Inspection
  • Pick and Place
  • Potting and Encapsulation
  • Process Control
  • Printing/Jetting
  • Reflow and Wave Soldering
  • Selective Soldering
  • Solders
  • Solderability
  • Solder Mask
  • Testing
  • Tin Whiskers Risk Mitigation
  • X-Ray Inspection

Abstracts must be submitted by April 2, 2012, and should detail case histories, field data, new technologies or innovation, or research and findings. In addition, abstracts should summarize the problems and resolutions, procedures used, results of experiments and benefits to the industry.

Oral presentations will be limited to 20 minutes, plus an additional 10 minutes for questions and answers. Presentations must be noncommercial and focused on technology rather than a company's product and must not have been previously presented.

To submit an abstract, visit: www.IPCMidwestShow.org/CFP

Thursday, 08 March 2012 10:30

IPC APEX EXPO Surges in San Diego

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The electronic interconnect industry came together at IPC APEX EXPO® last week in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4,915 conference and exhibit hall attendees. IPC – Association Connecting Electronics Industries® reported that 407 exhibitors participated in the event, resulting in 8,963 total visitors.

The show was the best attended IPC APEX EXPO in more than four years. IPC APEX EXPO is the largest event in North America focused on the printed board and electronics manufacturing industries.

“We are very pleased that the industry responded to IPC APEX EXPO in San Diego whether it was on the show floor, in classrooms or technical committee meetings,” said Tony Hilvers, IPC vice president of industry programs. “All the exhibitors we talked to were very positive about both the quality and quantity of the leads. We’ve even received the first contract — with an expansion request — from an exhibitor for 2013.”

Scott Wischoffer, representing Fuji America Corporation and chairman of the IPC APEX Trade Show committee added, “I'd like to thank everyone for making the show a spectacular event! The booth traffic was excellent, the leads were strong and the excitement of a great upcoming year was something that could be felt. San Diego is a clean, beautiful, dynamic city with a great waterfront and an unrivaled selection of restaurants and bars within walking distance of the convention center. We're looking forward to coming back again next year for IPC APEX EXPO 2013!”

In addition to a lively show and conference, IPC APEX EXPO kicked off its first hand soldering contest, culminating in a Grand Championship competition. Adam Conaway, S and Y Industries, was named the Grand Champion, scoring ahead of the winner from IPC Midwest Conference & Exhibition Nicole DeVries, Raven Industries, and IPC Europe’s Linnea Gyllner, TRIAB Elektronik AB.

IPC APEX EXPO will return to the San Diego Convention Center, February 19–21, 2013. Industry researchers, engineers and academics are invited to submit an abstract for consideration in next year’s technical conference or professional development courses.

For more information, visit: www.IPCAPEXEXPO.org

Wednesday, 29 February 2012 11:36

130 Awards Presented at IPC APEX EXPO

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IPC – Association Connecting Electronics Industries® presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO®  at the San Diego Convention Center.

This year, two Presidents Awards were presented. William Coleman, Ph.D., Photo Stencil Inc. received a Presidents Award for his dedicated service and technical contributions over the past 15 years in the area of solder stencils as an author and IPC task group chair and as a speaker at numerous IPC conferences. Mike Bixenman, DBA, Kyzen Corporation, also received a Presidents Award for his dedicated service as the 5-31g Cleaning and Coating Task Group chair and for his contributions as chair of past cleaning and coating conferences and as a speaker in numerous other IPC conferences.

Awards were also presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through active IPC committee service.

For leadership and valuable service as chair of the IPC PCB Suppliers Management Steering Committee, Don Walsh, Uyemura International Corporation, earned a Special Recognition Award.

For leadership of the 5-41 SMT Component Placement Equipment Subcommittee that developed IPC-9850A, Surface Mount Placement Characterization, Michael Cieslinski, Panasonic Factory Solutions Company of America, and Peter Borg, Research in Motion Limited, were honored with Committee Leadership Awards. For their contributions to IPC-9850A, Nils Jacobsson, MYDATA automation AB, and Mark Maas, Assembleon Netherlands B.V., earned Distinguished Committee Service Awards.

For leadership of the 5-32b SIR and Electrochemical Migration Task Group that developed IPC-9202, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance, Graham Naisbitt, Gen3 Systems Limited; Douglas Pauls, Rockwell Collins; and Russell Shepherd, Microtek Laboraories, received Committee Leadership Awards. For their contributions to IPC-9202, Brian Madsen, Ph.D., Continental Automotive Systems; Chris Mahanna, Robisan Laboratory Inc.; Joseph Russeau, Precision Analytical Laboratory, Inc.; and Kirk Van Dreel, Plexus Manufacturing Solutions, earned Distinguished Committee Service Awards.

For their leadership of the D-23 High Speed/High Frequency Base Materials Subcommittee that developed IPC-4103A, Specification for Base Materials for High Speed/High Frequency Applications, Edward Sandor, Taconic Advanced Dielectric Division, and Roy Keen, Rockwell Collins, were bestowed with Committee Leadership Awards. Distinguished Committee Service Awards went to Silvio Bertling, Neltec, Inc.; Michael Brandon, Isola Group SARL; Joseph Davis, Rogers Corporation; Patricia Dupuis, Raytheon Company; Matthew Walsh, NSWC Crane; Dan Welch, Arlon Materials for Electronics; and Lowell Sherman, Defense Supply Center Columbus, for their contributions to IPC-4103A.

For co-chairmanship of the 5-21e Solder Stencil Task Group that developed IPC-7525B, Stencil Design Guidelines, William Coleman, Ph.D., Photo Stencil Inc., and George Oxx Jr., Jabil Circuit, Inc., were honored with Committee Leadership Awards. William Kunkle, MET Associates Inc., and Russell Nowland, Alcatel-Lucent, earned Distinguished Committee Service Awards for their contributions to IPC-7525B.

For leadership of the 5-22f J-STD-001 Handbook Task Group that developed IPC-HDBK-001E, Handbook and Guide to Supplement J-STD-001, Daniel Foster, U.S. Army Aviation & Missile Command, and Kathy Johnston, Raytheon Missile Systems, received Committee Leadership Awards. Distinguished Committee Service Awards for contributions to IPC-HDBK-001E went to: David Adams, David Hillman and Douglas Pauls, Rockwell Collins; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Casimir Budzinski, Safari Circuits Inc.; David Carlton, Calette Chamness, Jennifer Day and Sharon Ventress, U.S. Army Aviation & Missile Command; Bettye Causion and Teresa Rowe, AAI Corporation; Matt Garrett, Phonon Corporation; Greg Hurst, BAE Systems; Paula Jackson, Raytheon Systems Ltd.; Joseph Kane, BAE Systems Platform Solutions; Patrick Kane, Raytheon System Technology; Sean Keating, Amphenol Limited (UK); Leo Lambert and Helena Pasquito, EPTAC Corporation; John Mastorides, Honeywell International; Norman Mier Jr., BEST Inc.; Mary Muller, Crane Aerospace & Electronics; David Nelson, Raytheon Company; Gregg Owens, Space Exploration Technologies; Richard Rumas, Honeywell Canada; Patricia Scott, STI Electronics, Inc.; and Zenaida Valianu, Celestica.

For her chairmanship of the 7-31ft task group that developed hands-on training for the IPC/WHMA-A-620 Technical Training program and the IPC/WHMA-A-620AS Space Addendum Training and Certification course, Debbie Wade, Advanced Rework Technology–A.R.T., was recognized with a Committee Leadership Award. For contributions to the optional hands-on training for the IPC/WHMA-A-620 Training and Certification course, Leo Lambert, EPTAC Corporation; Richard Rumas, Honeywell Canada; Blen Talbot, L-3 Communications; Terry Clitheroe, Solder Technologies; and Stephen Fribbins, Fribbins Training Services, received Distinguished Committee Service Awards. Distinguished Committee Service Awards also went to Robert Cooke, NASA Johnson Space Center; Robert Humphrey, NASA Goddard Space Flight Center; Garry McGuire, NASA Marshall Space Flight Center; and Mel Parrish and Brandy McGinniss, STI Electronics, Inc., for their contributions to the development of the IPC/WHMA-A-620AS Space Addendum Training and Certification course. For contributions to the development of both the optional hands-on training for the IPC/WHMA-A-620 Technical Training program and the IPC/WHMA-A-620AS Space Addendum Training and Certification course, Patricia Scott, STI Electronics, Inc., and Daniel Foster, U.S. Army Aviation & Missile Command, earned Distinguished Committee Service Awards.

For leadership of the D-11 Flexible Circuits Design Subcommittee that developed IPC-2223C, Sectional Design Standard for Flexible Printed Boards, William Ortloff Sr., Raytheon Company, and Mark Finstad, Flexible Circuit Technologies, Inc., earned Committee Leadership Awards. For their contributions to IPC-2223C, Lance Auer and Steve Musante, Raytheon Missile Systems; John Bauer, Rockwell Collins; Thomas Gardeski, Gemini Sciences LLC; Nick Koop, Minco Products Inc.; Robert Sheldon, Pioneer Circuits Inc.; and Clark Webster, ALL Flex LLC, were honored with Distinguished Committee Service Awards.

For their leadership of the 7-35 Assembly and Joining Handbook Subcommittee that developed IPC-AJ-820A, Assembly and Joining Handbook, Mary Muller, Crane Aerospace & Electronics, and Joseph Kane, BAE Systems Platform Solutions, were bestowed with Committee Leadership Awards. For their contributions to IPC-AJ-820A, David Adams, Rockwell Collins; Peggi Blakley, NSWC Crane; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Nancy Chism, Flextronics; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Hue Green, Lockheed Martin Space Systems Company; Leo Lambert, EPTAC Corporation; Randy McNutt, Northrop Grumman Corp.; Teresa Rowe, AAI Corporation; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned Distinguished Committee Service Awards.

For co-chairmanship of the 4-14 Plating Processes Subcommittee that developed Amendment 1 to IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, George Milad, Uyemura International Corp. and Gerard O’Brien, Solderability Testing & Solutions, Inc., were honored with Committee Leadership Awards. For their contributions to IPC-4554, Amendment 1, Distinguished Committee Service Awards went to Martin Bayes, Ph.D., Dow Electronic Materials; Trevor Bowers, Adtran Inc.; Ellen Finch and Thomas Gahagan, Anaren Microwave Inc.; Albin Gruenwald and Donald Gudeczauskas, Uyemura International Corp.; David Hillman, Rockwell Collins; Henry Lajoie and James Trainor, OMG Electronic Chemicals Inc.; Brian Madsen, Ph.D., Continental Automotive Systems; Mustafa Oezkoek and Gustavo Ramos, Atotech Deutschland GmbH.

For their leadership of the 5-24a Flux Specifications Task Group that developed Amendment 1 to J-STD-004B, Requirements for Soldering Fluxes, Renee Michalkiewicz,Trace Laboratories – Baltimore, andJohn Rohlfing, Delphi Electronics and Safety, earned Committee Leadership Awards. For their contributions to J-STD-004B, Amendment 1, Tim Jensen, Indium Corporation of America; David Scheiner, Kester; Karen Tellefsen, Ph.D., Cookson Electronics; and Brian Toleno, Ph.D., Henkel Corporation, received Distinguished Committee Service Awards.

For co-chairmanship of the 2-18f Declaration of Shipping, Pack and Packing Materials Task Group that developed IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials, John Ciba Jr., Brady Corporation, and Lee Wilmot, TTM Technologies, Inc., were recognized with Committee Leadership Awards. Honored with Distinguished Committee Service Awards for their contributions to IPC-1758 were: Christine Blair, STMicroelectronics Inc.; Matt Carey, TTM Technologies; Krista Crotty, Alberi EcoTech; Amanda Davidson, Freescale Semiconductor, Inc.; Randall Flinders, RTF Compliance LLC; Robert Green, RDG Company LLC; William Haas, Seagate Technology; Michael Hutchings, Oracle America, Inc.; Kurk Kan, Murata Power Solutions, Inc.; Marcus Khoo, Altera Corporation; Richard Kubin, ProCM; John Messina, NIST; Jack Olson, Caterpillar Inc.; Daphane Robinson, Brady Corporation; John Sharp, TriQuint Semiconductor Inc.; Aimee Siegler, Benchmark Electronics Inc.; and Kelly St. Andre and Jorgen Vos, PTC.

For more information, visit: www.ipcapexexpo.org

Renowned for the industry’s premier technical conference and courses, IPC APEX EXPO® also includes ample opportunities to learn about industry issues and find solutions free of charge. Exhibits-only registration to IPC APEX EXPO is free to individuals who register in advance and includes access to: inspiring and informative keynote sessions; BUZZ sessions covering key industry topics; the NPL Process Defect Clinic; free special events; and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test. IPC APEX EXPO will take place February 28–March 1, 2012, at the San Diego Convention Center.

Hollywood icon William Shatner will open the show on Tuesday with an entertaining and inspiring keynote address on his true life mission to explore “strange new worlds” and “seek out new life.” Wednesday’s keynote will host a distinguished panel of experts who will provide unique insights into future game changers in the industry.

BUZZ sessions, February 28–March 1, will cover critical industry topics such as process defects; embedded technologies; conflict minerals; supply line issues of obsolescence, quality and compliance of parts and counterfeit parts; breaking research from academia; the industry’s first solar standard for electronics assemblies; and the just-released IPC International Technology Roadmap.

On February 28, the IPC Government Relations committee will hold an open forum to provide an update on IPC’s advocacy efforts to protect printed circuit board designs for military products under ITAR and offer the latest information on the impending conflict minerals regulation.

On the show floor, attendees will be able to get free, unbiased help with their process-related issues at the NPL Defect Database Clinic. In addition, participants can visit the New Product Zone for a sneak preview of the equipment, materials and services that are breaking new ground in the industry, and then go to cheer on the competitors in the IPC APEX EXPO Hand Soldering Competition and IPC Grand Championship.

The show offers myriad opportunities to network with industry peers and make new contacts from around the world including the International Reception, the First-Timers’ Breakfast, the Women in Electronics Networking Meeting and the expanded Show Floor Reception on Wednesday afternoon.

Featuring more than 400 exhibitors and offering a new focus on printed electronics, the exhibit hall provides an unparalleled venue to shop and compare the newest technologies and services.

To register or for more information on all the activities at IPC APEX EXPO, including the technical conference, standards development meetings and professional development courses, visit: www.IPCAPEXEXPO.org

Representing advances in more than 100 product categories within the electronics manufacturing supply chain, more than 250 new products and services will debut at IPC APEX EXPO®, February 28–March 1, 2012, at the San Diego Convention Center. New products will be introduced by over a quarter of the more than 400 exhibitors — a fitting testament to the event’s theme, Information that Inspires Innovation.

“Companies in our industry have to not only successfully navigate today’s extremely competitive economy, but also thrive in an industry that demands innovation and performance like never before,” says Alicia Balonek, IPC director of trade show operations. “As the largest electronics manufacturing exhibition in North America, IPC APEX EXPO provides them with an ideal venue to really show off their new equipment, products and services, and to engage in valuable conversations with customers, existing and potential, on current and future needs.” Balonek adds that because of the breadth and depth of the show floor, attendees get, “a one-stop shopping event where they can learn about the new products, make important face-to-face contacts and discover solutions to the challenges they face in the workplace each day as well as ways to save money.”

Filling two levels of exhibit halls, companies serving the electronics assembly, test and printed board industries will present the latest technologies, materials and processes to help attendees gain efficiencies, enhance their processes and get up to date on new industry research and developments.

A new addition to this year’s show floor is the New Product Zone, which gives exhibitors an opportunity to highlight leading-edge equipment, materials and services that are breaking new ground for the industry.

Equipment and materials for electronics assembly, manufacturing and test; chemicals, materials and equipment for PCB manufacturing; design software; and printed electronics are all categories that will be represented on the show floor. New products offer practical solutions to critical industry concerns, such as meeting the requirements of new environmental regulations, compatibility and reliability issues and storage.

To help attendees focus on the products and services of most interest to them, IPC offers My APEX EXPO, an online tool that allows registered participants to preview exhibitors, access company information, view new product information, set up appointments and schedule other show activities.

Exhibits-only registration is free to pre-registrants and provides access to the exhibition and to free events, such as the Opening Keynote featuring Hollywood icon William Shatner, educational “BUZZ” sessions, technical poster presentations, the NPL Defect Database Clinic, Wednesday’s Show Floor Reception and numerous free networking activities.

A complete list of new products to be displayed can be found at: www.IPCAPEXEXPO.org/My-Show

Thursday, 29 December 2011 10:03

William Shatner to Keynote IPC APEX EXPO 2012

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With all votes tallied from the special IPC APEX EXPO® keynote speaker election, William Shatner has emerged the clear winner, taking the popular vote by a considerable margin over the other candidates. The award-winning actor, director, producer, writer, recording artist, horseman and major philanthropist will serve as the IPC APEX EXPO 2012 Opening Keynote speaker at 8:30 am on February 28, at the San Diego Convention Center in San Diego, Calif.

One of Hollywood’s most recognizable figures, Shatner has cultivated a career spanning more than 50 years with life inspirations that have taken him into myriad arenas. Perhaps recognized best for his role as Captain James T. Kirk, Shatner has numerous accomplishments in television, film, and stage, including Emmys, Golden Globes and SAG award nods. At the tender age of 80, Shatner, much like his horses, does not like to stand still.

Ironically, his real-life mission resonates with an all-too-familiar prologue to “seek out new life.” In his keynote address, “Captain’s Log — Boldly going where no man has gone before…,” Shatner will share his life’s inspirations, his drive to “explore strange new worlds,” and his newly published set of rules to live by.

Shatner has authored nearly 30 best-sellers in both the fiction and nonfiction genres. His autobiography, Up Till Now, was a New York Times best-seller. In Shatner’s latest book, Shatner Rules: Your Guide to Understanding the Shatnerverse and the World at Large, he provides a glimpse of what makes him uniquely Bill and he presents a number of rules that, he says, like his life are, “suitably unique, strange and worthy of some measure of wonder.” While he admits that many of the rules are tongue-in-cheek, he stands by the fact that, “in their amusement, there is a truth.”

IPC APEX EXPO attendees will relish an intimate and amusing visit with this illustrious American icon as he sets the tone for a week of exploring new research, new products and new opportunities to innovate and to boldly go where no man has gone before.

Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site.

The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1.

For more information or to register, visit: www.IPCAPEXEXPO.org

Friday, 23 December 2011 09:30

IPC Announces Winter 2012 Webinar Schedule

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Offering convenient and cost-effective staff development, IPC – Association Connecting Electronics Industries® announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Webinar topics include:

Soldering and Assembly Defects – Causes and Cures (free for all attendees)
Bob Willis, ASKbobwillis.com
Thursday, January 12

New Developments in ENIG and ENEPIG for Today's Electronic Products
George Milad, Uyemura International Corp.
Thursday, January 19

Everything You Always Wanted to Know About TH Soldering but Were Afraid to Ask
Bob Klenke, ITM Consulting
Thursday, January 26

Why Wedge Bond
Lee Levine, Hesse & Knipps
Tuesday, January 31

Key Issues in BTC Design & Assembly for Improved Reliability and Yield
Ray Prasad, Ray Prasad Consultancy Group
Wednesday, February 1

Rework of Bottom Terminated Components (QFNs, LGAs, etc)
Norman Mier, BEST, Inc.
Thursday, February 2

Troubleshooting SMT Yield Problems
Ray Prasad, Ray Prasad Consultancy Group
Tuesday, February 7

Life After the Super Committee Deadline – What Now?
Keith Smith; Rich Meade, Prime Policy Group
Wednesday, February 8

Flex Repair
James Bernhardt, BESTProto Inc.
Tuesday, March 13

Discussion and Highlights of IPC-4204A, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Clark Webster, All Flex LLC; Michael Beauchesne, Amphenol Printed Circuits
Thursday, March 15

With the exception of the soldering and assembly defects webinar which is free, the registration fee of $75 per login for IPC members or $100 industry standard rate per login covers as many employees as can fit in a company's conference or training room.  Webinars will run from 10:00 am to 11:00 am, Central time, except for the January 12 soldering and assembly defects webinar which will run from 12:00 pm to 1:00 pm, Central time.

For more information and to register, visit: www.ipc.org/webinar-schedule

In January 2012, IPC will launch IPC Outlook, an electronic newsletter and Web portal for multimedia information about technology, standards, best practices and industry research. The new e-publication will focus on information that helps engineers and managers succeed in their jobs.

Based on feedback from a major communications study conducted by IPC in 2011, the distribution of IPC Outlook will be weekly and open to all individuals working in the electronics manufacturing industry. Regular features will include sections on cleaning; new product innovations; expert Q & A; defect analysis; materials; production floor; supply chain and IPC updates.

“This is a major step for IPC,” says IPC Vice President of Marketing & Communications Kim Sterling. “Broadening our communications within the industry will reinforce IPC’s already-strong position as ‘the most trusted’ outlet for supporting the needs of industry companies, with critical and reliable information.”

“IPC Review, our member newsletter, will transition into IPC Outlook and provide information that’s more timely and dynamic,” continues Sterling. “This is an exciting opportunity for more people in the industry to benefit from IPC’s commitment to education and information exchange.” Sterling confirms that IPC members will enjoy privileged access to more information and resources in the members-only section of the IPC website.

A subscription to IPC Outlook is free. For more information, visit: www.IPCOutlook.org

Thursday, 20 October 2011 11:09

IPC Announces Fall Webinar Schedule

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Offering a cost-effective and convenient way to train employees on timely industry topics, IPC – Association Connecting Electronics Industries® webinars deliver one hour of trusted education to the comfort of companies’ conference rooms. Focused on technical, practical and management issues facing the electronics industry, these sessions are based on award-winning technical papers from IPC APEX EXPO® 2011. IPC’s fall schedule of webinars in October, November and December 2011 include:

Electronics Failure Analysis: Common Mechanisms & Techniques
Cheryl Tulkoff, DfR Solutions
Thursday, October 20

Is Cleaning Critical to PoP Assemblies?
Umut Tosun, ZESTRON
Tuesday, November 8

LED Testing & Reliability
Diganta Das, Ph.D., CALCE
Wednesday, November 9

Practical Steps to Effective Defluxing
Barbara Kanegsberg, BFK Solutions LLC; Ed Kanegsberg, Ph.D., BFK Solutions LLC
Thursday, November 10

Component PWB Requirements Based on UL/IEC 60950-1 and IEC 62368-1
Crystal Vanderpan, Underwriters Laboratories; Thomas Burke, Underwriters Laboratories
Wednesday, November 16

Business Outlook for 2012
Walt Custer, Custer Consulting Group; Ed Henderson, Henderson Ventures; Sharon Starr, IPC
Tuesday, December 6

Techniques in the Rework of High Thermal Mass Boards
Bob Wetterman, BESTProto Inc.; Jim French, BEST Inc.
Tuesday, December 13

Counterfeit Detection Strategies: When to Do It/How to Do It
Cheryl Tulkoff, DfR Solutions
Thursday, December 15

Most webinars will run from 10:00 am to 11:00 am, Central time. The registration fee for most webinars is $75 per login for IPC members and $100 per login for nonmembers. The Business Outlook webinar is $100 per login for IPC members and $150 per login for nonmembers and will run from 10:00 am to 11:30 am, Central time.

An organization can stretch its staff development budget by training multiple employees in a conference room equipped with a speakerphone and projector. For more information and to register, visit: www.ipc.org/fall-webinars

Monday, 10 October 2011 11:48

Search for New IPC President and CEO Begins

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IPC – Association Connecting Electronics Industries® is seeking an outstanding individual to become its next president and chief executive officer (CEO). The candidate will succeed current CEO Denny McGuirk, who leaves on November 3 to become president of SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains.

The executive search firm Korn/Ferry International has been retained for the search. IPC is a global trade association headquartered in Bannockburn (Chicago), Ill. The association serves 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. IPC is a member-driven organization and leading source for industry standards, training, market research and public policy advocacy. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Moscow, Bangalore, Shanghai, Shenzhen and Beijing.

As the chief executive of the association, the president and CEO is responsible for providing strategic leadership and vision by working with the Board of Directors and other stakeholders to establish long-range goals, strategies, plans and policies. The president oversees association operations and policies, delivery of services to the membership and overall programming. He or she is ultimately responsible for IPC’s fiscal performance.

“I am privileged to have led IPC through some very challenging times over the past 12 years and to have worked with such dynamic individuals on our Board. I am very proud of what we have achieved, especially in broadening IPC’s global reach. I will miss the many friends I’ve made in the industry and I look forward to seeing IPC’s future success,” said McGuirk.

“It was my pleasure to work closely with Denny on developing strategies and future plans for IPC. The industry and the organization have been through incredible change and he made a difference with his steadiness and commitment. He has been the right man for the job and we have all benefitted from his dedication,” noted IPC Board Chairman Bob Ferguson, executive vice president, Electronic Materials & North Asia, Avantor Performance Materials.

The search for IPC’s next president and CEO is expected to take up to six months. Jim Herring, former IPC Board chairman and president of Applied Corporate Solutions, LLC has been appointed interim president and CEO of IPC, effective November 3.

Korn/Ferry International was chosen to conduct the search after an exhaustive selection process. The firm, with a presence throughout the Americas, Asia Pacific, Europe, the Middle East and Africa, is a premier global provider of talent management solutions.

Interested candidates should contact Korn/Ferry Senior Partner and National Association Practice Leader Lorraine Lavet with a resume and cover letter at This e-mail address is being protected from spambots. You need JavaScript enabled to view it

For more information, visit: www.ipc.org

In the realm of what you don’t know can hurt you, U.S. regulations on the import and export of sensitive electronics are constantly evolving. To help PCB manufacturers ensure compliance with International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR), IPC will hold a comprehensive workshop, ITAR/EAR Compliance for PCB Manufacturers — Complying with U.S. Export Controls, December 6–7, 2011, in Washington, D.C.

“The regulatory controls environment for leading-edge electronics is a moving target, which can make it difficult for many companies to keep up-to-date on the latest changes in the export of products, services and technical data sold by U.S. businesses,” explains Tony Hilvers, IPC vice president of industry programs. “Just earlier this week, IPC submitted comments to the U.S. Department of Commerce’s proposed revisions to EAR.” He adds that even businesses that do not export are increasingly subject to export-control related requirements from both ends of the supply chain.

ITAR and EAR experts, attorneys Kerry Scarlott and Eby Pineda-Dorcena of Goulston & Storrs, will spearhead the two-day workshop. The first day will focus on ITAR, while the second will extensively examine EAR. Speakers will address changes as well as requirements that govern sales activities in foreign jurisdictions and the use of foreign workers within the United States.

Each day, one session will be devoted to pending legislation that is likely to alter each regulation. Additional sessions will help participants understand the key elements of effective compliance plans for both ITAR and EAR and review enforcement and penalties for noncompliance.

OEMs and others will tell attendees about their experiences with government officials who enforce the regulations. Case studies will provide insight into programs that have proven successful. Speakers will also explain how companies can determine which regulatory regime applies to different types of business activities.

IPC’s ITAR/EAR workshop will be held in conjunction with the IPC Conference for the PCB Industry: Critical Issues for the Military Market, scheduled for December 8.

For more information on and to register for the ITAR/EAR Compliance for PCB Manufacturers workshop, visit: www.ipc.org/ITAR-EAR-workshop

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, February 28–March 1, 2012, at the San Diego Convention Center, San Diego, Calif. Poster presentations offer exposure to key engineers, managers and executives attending the show.

Technical poster presentations are being sought on all relevant electronics topics including design, materials, assembly, processes and equipment. Submissions in the areas of printed electronics, packaging & components, surface finishes, reliability and lead-free assembly are especially encouraged.  An abstract of up to 300 words summarizing technical and previously unpublished, noncommercial work covering case histories, research and discoveries should be submitted by November 25, 2011.

For more information on poster submission and other participation, visit: www.IPCAPEXEXPO.org/CFPosters

After 12 years as the president and CEO of IPC — Association Connecting Electronics Industries®, Dennis “Denny” P. McGuirk has resigned to accept a new position as president and CEO of SEMI, a global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. His last day at IPC will be November 1.

“Denny has been a tremendous leader and a great friend to our industry. I am sure I speak for the entire board in saying that he will be sadly missed. IPC is in a great position thanks to his hard work and dedication,” says Robert Ferguson, chairman of the IPC Board of Directors.

In his tenure at IPC, McGuirk steered the organization through two difficult recessions and reshaped IPC into a global organization. When he joined IPC in 2000, the organization had 2,500 members with less than 25 percent located outside of the United States. Under his leadership, IPC’s reach and services significantly expanded onto new continents. Today, IPC has more than 3,000 members of which 38 percent are located outside the United States, and its programs and services are delivered globally. IPC maintains offices in the United States, Stockholm, Moscow, Bangalore, Shanghai, Shenzhen, Suzhou and Beijing. The organization has 75 authorized training centers in the United States, Asia and Europe and has published 105 translated standards.

McGuirk says, “I have thoroughly enjoyed serving as president and CEO of IPC during this exciting and challenging time. The involvement and interaction with the board of directors, our staff and most importantly, our members around the world has been personally and professionally rewarding for me. I am confident the organization will go on to even greater success in the future and I look forward to following the progress of the organization and all of the friends I’ve made along the way.”

Ferguson will chair a search committee that will conduct a global search for McGuirk’s replacement.    

IPC is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Shanghai, Shenzhen and Beijing, China.

For more information, visit: www.ipc.org

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

To help engineers meet increasingly stringent performance requirements, the session, “Test and Measurement Solutions,” will spotlight research from Robisan Laboratory, Foresite, Agilent Technologies, Kyzen, IEC Electronics and Precision Analytical Laboratory that addresses issues from nanotechnology-based measurements for evaluating roughness of copper conductors on printed boards to evaluations of the combination of materials and processes for determining surface insulation resistance and electrochemical migration performance. In addition, Trace Laboratories will review a means to develop a counterfeit inspection procedure for incoming materials.

In “Minimizing Defects in Assembly Processing,” experts from DfR Solutions, Research In Motion Ltd., and IPC will guide participants through critical issues that influence defect levels in assembly processing, including the utilization of design for reliability (DFR) concepts to eliminate common mistakes at the design level. Also, the latest work from the IPC Solder Products Value Council (SPVC) and a new industry standard addressing visual examination and cross-sectioning for the evaluation of underfills will be discussed.

Improving printed board functionality and minimizing space through the use of both embedded and bottom termination components have received increased industry focus, but each comes with its own set of implementation challenges. To address these challenges, presentations from Solberg Technical Consulting, Indium and Ray Prasad Consultancy will be featured in, “Bottom Termination and Embedded Component Challenges.“ In addition, the session will cover the difficulties of achieving good yields due to package and printed board planarity issues that bottom termination components pose (with their absence of solder balls), as well as voiding, resulting from the outgassing of solder paste flux in proximity to thermal pads.

In “Lead-Free Solder Alloys and Thermal Cycling Performance,“ experts from Indium, Rockwell Collins, Christopher Associates and Cobar Europe B.V. will address the minute changes in alloy content that can improve drop shock and thermal cycle reliability of low-silver alloys. Participants will also be privy to two revealing studies: an investigation of a solder joint integrity assessment of tin/bismuth component surface finishes in both tin-lead and lead-free free soldering processes under thermal cycling conditions, and a ten-year study of the consistency of alloys in wave soldering processes, including contamination and copper leaching.

New research from Continental Automotive Systems, DfR Solutions and Christopher Associates will highlight the last session on September 22, “Assembly Materials and Component Reliability Testing.” This session will provide test data on a number of programs, including a comparison of solder spread results for multiple printed board surface finishes using various lead-free solder pastes; a methodology for predicting the reliability of complex ICs, such as FPGAS, ADCs and memory; and a report of performance results for a new plasma polymer printed board surface finish, including storage robustness, corrosion resistance and solderability.

Complete information on the technical sessions at IPC Midwest is available at www.IPCMidwestShow.org/conference. Attendees who register by August 19 can take 20 percent off their registration fees. Other special registration packages and options, including free exhibit hall registration, may be viewed at www.IPCMidwestShow.org/Register.

Monday, 06 June 2011 10:31

IPC Announces Summer Webinars

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IPC announces Summer Webinars for June, July and August 2011. Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organizations cost-effective opportunities to bring important new information directly to their conference rooms.

The following webinars will run from 10:00 am to 11:00 am Central time:

Assembly Guidelines for Pin in Paste Process
Guhan Subbarayan, Ph.D., Cisco Assembly Sciences and Technology Team
Wednesday, June 15, 2011

PCB Design and Assembly Process Planning for QFN and Other Bottom Termination Components
Vern Solberg, STC Madison
Thursday, June 23, 2011

Conflict Metals: How This Issue Will Affect Your Business
Tony Hilvers and Fern Abrams, IPC
Monday, July 11, 2011

A New Method Measuring Conformal Coating Adhesion
Chris Hunt, Ph. D., National Physical Laboratory (NPL)
Wednesday, July 13, 2011

Cleaning Highly Dense Circuit Assemblies and Advanced Packages
Mike Bixenman, DBA, Kyzen Corporation
Tuesday, July 19, 2011

Printed Electronic (PE) Circuit Process for LED Interconnection
Mike Dubois, Caledon Controls
Wednesday, July 20, 2011

A New Approach for Early Detection of PCB Cratering Failures
Anurag Bansal, Ph.D., Cisco Systems
Wednesday, July 27, 2011

DFM — Design for Manufacturing
Cheryl Tulkoff, DfR Solutions
Wednesday, August 3, 2011

ITAR Compliance Basics and Cyber Security for Level 3 Manufacturers
Bob Richardson and John Burton, TeamITAR™
Tuesday, August 9, 2011

Effects of Flux Residues on Reliability
Eric Bastow, Indium Corporation
Wednesday, August 10, 2011

The registration fee for each webinar is $75 per login for IPC members and $100 per login for nonmembers. An organization can stretch its staff development budget by training multiple employees in a conference room, equipped with a speakerphone and projector.

For more information and to register, visit: www.ipc.org/summer-webinars

IPC — A market analysis prepared for the U.S. Air Force by IPC — Association Connecting Electronics Industries® shows an estimated one-third of all printed circuit boards (PCBs) for U.S. defense or military systems are produced outside North America.

Based on data from IPC’s market research as well as data from N.T. Information and other electronics industry consultants, IPC’s analysis concluded that the value of the U.S. military market for PCBs is between $1.05 billion and $1.23 billion. Depending on the market size estimate used, between 27 and 39 percent of all PCBs in products sold to the U.S. military are manufactured outside North America.

“North America has a competent, competitive and organized supply base to support current and future Department of Defense (DoD) requirements for PCB technology,” says Denny McGuirk, IPC president and CEO. “In IPC’s Electronic Interconnect Industry Policy Recommendations to the DoD Printed Circuit Board Executive Agent, the industry recommends that DoD should also source non-critical technology from North American manufacturers to support a robust and technical advanced domestic supply base.”

The policy recommendations report also notes that the North American PCB manufacturing base competes for very complex, high-tech DoD products that are characterized by very high material content, very long build cycles and very low yields. Greater prominence in fulfilling the DoD’s lower-technology needs would support a stronger infrastructure for North American manufacturers.

The critical importance of the North American PCB industry to strengthen and protect U.S. national security is one of three issues being addressed by attendees during IPC’s Capitol Hill Day, June 15–16, 2011, in Washington, D.C.

Capitol Hill Day participants will meet with members of Congress to educate them on the complexities of conflict minerals regulations as well as the impact of those regulations on their companies. They will also urge their legislators to address government over-regulation.

Participants will also network with other manufacturers and members of the National Association of Manufacturers (NAM) in shared social events and learn about technologies that represent the best opportunities to ensure a U.S. electronics manufacturer’s success. Attendees will find out how they can use government resources, such as federal procurement technical assistance, trade adjustment assistance grants, small-business innovation research grants and other resources to strengthen their businesses.

For more information or to register for IPC Capitol Hill Day, visit www.ipc.org/CHD

Due to scheduling deadlines for special events held in conjunction with NAM, IPC cannot accept registrations after June 9, 2011.

IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2012 IPC APEX EXPO™ at the San Diego Convention Center in San Diego, Calif.  The technical conference will be held February 28–March 1, 2012, and the professional development courses will be February 26–27 and March 1, 2012.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and the “Best International Paper” for authors from outside the United States.

Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions dealing with lead-free processing, repair and reliability, high-speed PCB laminates and new research in growing areas such as green technology, photovoltaics and printed electronics are especially encouraged.  A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by June 4, 2011. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of technical and/or appropriate test results.

In addition, course proposals are solicited from individuals interested in presenting half-day professional development (PD) courses on printed board design and manufacturing as well as electronics assembly processes and materials. Reimbursement for travel expenses and an honorarium are offered to PD course instructors.

Technical conference paper abstracts and course proposals are due June 4, 2011.  To submit an abstract or proposal, visit: www.IPCAPEXEXPO.org/CFP

IPC — Association Connecting Electronics Industries® has released verified attendance figures from IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas, indicating an eight percent increase over last year with 7,208 total participants. The number of attendees at the educational programs and exhibition grew an additional five percent over last year to 3,887, but most notably, 20 percent more of these attendees participated in the technical conference and/or professional development courses.

The largest event in North America dedicated to the electronic interconnect industry, IPC APEX EXPO saw a sizable increase in international attendance, representing 52 countries and nearly 20 percent of all attendees.

“International attendees are participating in the conference and courses in growing numbers, as well as the industry’s all-important standards development meetings,” says Denny McGuirk, IPC president & CEO. An activity unique to IPC events, standards setting is vital to the global electronics industry. McGuirk explains that as more industry leaders participate in standards meetings through IPC groups such as TGAsia and TGNordic, these individuals, he says, “… understand the value of face-to-face networking with their colleagues around the world to develop industry best practices.”

The increased attendance was also met with increased participation from companies on the show floor with 366 exhibitors, a 10 percent increase over 2010, spanning 112,820 square feet of exhibit space. The exhibition makes life for attendees like Steve Draws, a procurement professional with Plexus Corp., much easier. “This show is invaluable in helping me to research and evaluate products, and to make sensible, money-saving decisions on purchases for my company.” More than 78 percent of respondents to the IPC APEX EXPO postshow survey agree with Draws, indicating that the exhibition influences their buying choices throughout the year.

To help attendees sort through the information overload of the packed exhibition, IPC introduced “My APEX EXPO” this year, an online personalized show planner to help attendees effectively plan their itinerary to focus on their companies’ priorities.

“We were extremely pleased with a very steady flow of visitors in our booth, all three days,” says Scott Rushia, sales manager for Martin. “It was a good combination of people who came to the exhibition with Martin and Finetech rework systems on their prepared research list, as well as others who discovered us on the show floor. The days were full of relevant demos and we took some orders at the show.”

“APEX 2011 was the best show we have ever had at APEX,” extolls Bob Black, president & CEO of Juki. “The booth was consistently crowded and we received double the sales inquiries of last year. APEX is clearly the flagship show of the circuit assembly industry.”

INVENTEC Performance Chemicals (worldwide headquarters in France) also saw an increase in business. “With a 5 percent plus compared to 2010, the show in 2011 was a real success for us,” says Anke Sandra Meunier, communication manager for INVENTEC. “In addition, our two conference sessions, on cleaning PCBs and solder paste reliability, generated interesting technical feedback. APEX is always a great international show for us.”

Next year, IPC APEX EXPO trades in the bright lights of Las Vegas for the warm Pacific breezes of San Diego, February 28–March 1, 2012. Academics, researchers and others who wish to submit an abstract for consideration in next year’s technical conference or professional development courses, may view the 2012 IPC APEX EXPO Call for Participation at: www.ipcapexexpo.org/html/main/call-for-participation.htm

The electronics manufacturing industry is rapidly moving forward with innovative technologies and improved processes. The best of these advances will be on display when more than 250 new products and services debut at IPC APEX EXPO™, April 12–14, 2011, at the Mandalay Bay Resort & Convention Center in Las Vegas.

More than 350 exhibitors serving the electronics assembly and printed board industries will display the latest technologies, materials and processes to help companies gain efficiencies, enhance their processes and get up to date with emerging technologies. New products will be introduced by more than 100 of those exhibitors, many introducing multiple products.

“There is a remarkable array of new products at the show this year, representing every facet of our industry,” says Mary Mac Kinnon, IPC director of sales. “As the largest exhibition in North America for our industry, IPC APEX EXPO offers an unparalleled opportunity for attendees to shop and compare equipment, and discover new solutions and ways to improve company performance and productivity.”

The new products and services will represent a number of product categories, including equipment and materials for electronics assembly, manufacturing and test; chemicals, materials and equipment for PCB manufacturing; design software; and many more. These new products offer practical solutions to evolving industry challenges, such as meeting the requirements of new environmental regulations, compatibility and reliability issues and storage. A complete list of new products to be displayed at the exhibition can be found in the MY APEX EXPO Online Exhibit Hall.

To help attendees plan their itinerary for the show to focus in on the products and services of most interest to them, IPC introduced the My APEX EXPO Dashboard and Interactive Planner. This online planner allows attendees to preview exhibitors, access company information, view new product information, set up appointments and schedule in other show activities.

Exhibits-only registration is free to pre-registrants and provides access to the exhibition and free events such as a keynote session featuring Apple Computer co-founder Steve Wozniak, educational “BUZZ sessions,” technical poster sessions, a solar assembly and solar living pavilion, a process defect clinic and all free networking activities.

For more information or to register visit: www.ipcapexexpo.org

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