ANSYS (13)

For the first time engineers can rapidly explore design options and receive instant and accurate simulation results with new cutting-edge technology from ANSYS. Available for technology preview, ANSYS® Discovery Live™ revolutionizes the speed and ease-of-use of engineering simulation to make digital exploration available to all engineers so they can confidently design better products faster and more economically.

Simulation is one of the most critical engineering technologies in the age of the Internet of Things, electrification and additive manufacturing, but it is still the domain of specialists and used predominantly for the most complex engineering projects. ANSYS is expanding Pervasive Engineering Simulation™ – empowering every engineer to take advantage of powerful simulation tools upfront in the design process. Instead of taking days, months or weeks to set up, run and analyze digital prototypes with traditional engineering simulation solutions, Discovery Live allows for every engineer to immediately examine the impact of their design changes. Users can pose what-if questions upfront in the design process to rapidly explore thousands of design options and receive immediate feedback – enabling the user to digitally explore the impact of changes with results updating immediately.

"Discovery Live's breakthrough technology places real-time simulation in the hands of every engineer. Coupled with an equal step change in ease of use, it enables true digital experimentation," said Mark Hindsbo, vice president and general manager, ANSYS. "This will fundamentally change product development, inverting the traditional process by bringing simulation upfront and enabling millions of engineers to benefit from the power of simulation."

ANSYS has undertaken a breakthrough research and development effort to build a new simulation technology based on the massive parallel nature of graphics processing units (GPUs). NVIDIA GPUs deliver supercomputing capabilities and, when combined with the engineering simulation innovation of Discovery Live, results can now be calculated thousands of times faster than with conventional methods. This has been combined with nearly five decades of ANSYS experience and validation of simulation methods and best practices, making it intuitive for the non-simulation expert to use the software.    

"Designers, scientists and engineers around the world rely on ANSYS to accurately predict their final products and projects," says Bob Pette, vice president, Professional Visualization, NVIDIA. "ANSYS Discovery Live unleashes the power of NVIDIA GPUs and CUDA parallel computing to make the first ever real-time design environment with simultaneous visualization and simulation possible. We have a long history of working with ANSYS and look forward to our continued collaboration to advance breakthroughs in the way new products are designed and created."

Discovery Live supports fluids, structural and thermal simulation applications – enabling engineers to experiment with design ideas and see instant feedback. Users can run an analysis first approach as they design – enabling them to iterate with a 3-D model and interactively explore the impact of simple and complex changes. Discovery Live's environment provides users with instant simulation results, tightly coupled with direct geometry modeling to enable interactive design exploration and rapid product innovation.

"ANSYS Discovery Live is an exciting new tool that is very easy to use and can help us potentially move faster, learn new things and help us be more innovative. The tool allows us to use multiple physics and the results are practically instantaneous, so we can get answers to the quick 'what-if' studies very quickly – helping us engage more people in simulation with the ultimate goal of moving faster, better products on time," said Bob Tickel, director of structural and dynamic analysis, Cummins. "Cummins is committed to analysis-led design and I believe that Discovery Live will propel us forward faster in this area. We are very impressed and we see the potential to deploy this technology globally across all our different businesses."

Monday, 29 August 2016 15:27

ANSYS Announces New President/COO

Written by

ANSYS, Inc. (NASDAQ:ANSS) announced a leadership succession plan. James E. Cashman, who has served as ANSYS’ Chief Executive Officer since 2000, will become Chairman of the Board of Directors effective January 1, 2017. Dr. Ajei S. Gopal, a technology industry veteran who has served as a member of the ANSYS Board since 2011, has been appointed President and Chief Operating Officer effective immediately and will continue to serve on the Board. Dr. Gopal will become Chief Executive Officer on January 1, 2017. Ronald W. Hovsepian, who currently serves as Chairman of the ANSYS Board, will assume the role of Lead Independent Director as part of this transition.

Mr. Hovsepian said, “We are grateful to Jim for his remarkable leadership. He led ANSYS’ transformation from a $50 million revenue company into the global market leader for simulation technology with nearly $1 billion in revenue, creating significant value for stockholders. On behalf of the entire Board, I thank Jim for his countless contributions and unwavering commitment to ANSYS. His decision to implement this leadership succession plan was made with much thought and consideration, and we appreciate him working with the entire Board to help identify his successor and facilitate a smooth transition. We all look forward to benefitting from his continued guidance, vision and expertise as Chairman.”

Mr. Cashman said, “Over the past 20 years, we have grown ANSYS to become the world’s leading engineering software provider thanks to our relentless focus on innovation and commitment to our customers. Today, ANSYS has the most talented employees in the industry, a best-in-class portfolio, more than 45,000 customers worldwide and a sound growth strategy to take us into the future. As we look to scale to $2 billion in revenues and beyond, I strongly believe that now is the right time to begin the transition to the next generation of leadership. Attracting Ajei, a technology industry veteran with an exceptional track record, is a huge win for ANSYS. I have come to know and admire Ajei as a fellow director, and I have no doubt that his outstanding leadership, unique perspective and appreciation for ANSYS’ culture, people and organization make him the right choice to serve as our next leader during this exciting time.”

Dr. Gopal is a 25-year industry veteran with extensive management and business development experience at large software and technology companies. He has held leadership roles at companies including Symantec, Hewlett-Packard, CA Technologies and IBM, and also brings start-up experience, having co-founded ReefEdge Networks. He joined Silver Lake in April 2013 as an operating partner.

Dr. Gopal’s appointment as Mr. Cashman’s successor follows an extensive search conducted by the ANSYS Board with the assistance of Heidrick & Struggles, a leading independent executive search firm. The search included a review of both internal and external candidates.

Mr. Hovsepian continued, “There is no better person than Ajei to lead ANSYS through this pivotal time in the Company’s expansion. He brings a proven track record, expertise managing the scale and complexity of a global multi-billion dollar company and critical skills in software strategy, engineering, product management and development. Ajei has profound knowledge of our business and strategic direction, as well as significant financial discipline. We are excited to enter our next phase of growth under his leadership.”

Dr. Gopal said, “I am honored by the opportunity to lead ANSYS. With an accelerating pace of innovation, ANSYS is on an exciting growth trajectory as it executes on its long-term plans. Jim’s vision and tremendous leadership have set a high bar, and I am committed to building on our standard of excellence and pushing the boundaries of innovation to help customers solve their most complex design challenges. I look forward to working with Jim, the Board, our leadership team, employees and customers around the globe to continue our legacy and capture the vast market opportunity ahead to drive stockholder value.”

Separately and unrelated to the leadership succession plan, ANSYS also announced today that Robert Kocis, Vice President, Worldwide Sales and Support will depart on October 1, 2016, to pursue another opportunity in the Managed Services industry. ANSYS has a deep bench of sales talent and the sales organization will report to Dr. Gopal in his capacity as President and COO, effective immediately.

Dr. Gopal, 54, joined the ANSYS Board in February 2011. He has been an operating partner at Silver Lake since April 2013. In 2016, Dr. Gopal was seconded from Silver Lake to serve as interim president and COO at Symantec, leading the company through the acquisition of Blue Coat and the recruitment of a permanent CEO. Prior to Silver Lake, he was senior vice president and general manager at Hewlett-Packard from 2011. Earlier, Dr. Gopal was executive vice president at CA Technologies, which he joined in 2006. From 2004 to 2006, he served as executive vice president and chief technology officer of Symantec. Until 2004, Dr. Gopal was with ReefEdge Networks, a company he co-founded in 2000. Before that, he worked at IBM from 1991 to 2000, initially at IBM Research, and later in IBM’s Software Group. He began his career as a member of the technical staff at Bell Communications Research. Dr. Gopal has 23 U.S. patents to his name and has a doctorate in computer science from Cornell University and a bachelor’s degree from the Indian Institute of Technology in Bombay.

For more information, visit:

Wednesday, 12 August 2015 11:47

ANSYS 16.2 Released

Written by

Using the newly released ANSYS® 16.2, engineers can now create virtual prototypes of complete systems, enabling them to make significant strides in innovation and to unleash next-generation products within their industries.

As products – from automobiles to smartphones to wearable technology – become more complex and development times continue to shrink, the need to simulate whole systems grows. Through simulation, engineers can take full advantage of the growing number of opportunities presented by the rapid innovation of materials, electronics and processes. While some manufacturers have optimized the design of components or smaller sub-systems, until today's ANSYS release, no comprehensive solution has existed for simulating complete systems. The complexity within systems arises from the challenges of connecting the individual pieces to ensure they work together as designed. By developing complete virtual prototypes, leading companies can jump-start their innovation and leapfrog the competition.

Part of this new simulation approach is made possible by enhancements to ANSYS® Simplorer®, a comprehensive platform for multidisciplinary systems modeling. In this new release, Simplorer can now assemble and simulate electrical, electronic, thermo-fluid, mechanical and embedded software components. The methodology offers advanced 3-D precision when needed, as well as reduced-order modeling for verifying multi-domain system performance interaction.

ANSYS 16.2 offers significant advancements in systems engineering through ANSYS® AIM®, the first integrated and comprehensive multiphysics simulation environment designed for engineers, which was introduced earlier this year. AIM has rapidly developed and ANSYS 16.2 represents its next step forward. Among the many new multiphysics and systems capabilities are heat transfer and thermal-stress, gas flows, and structural deformation and stress.

Optimizing heat transfer and thermal-stress is a critical design issue for many types of industry applications, such as heat exchangers, thermal mixing valves, engine components and electronic devices. In such applications, an accurate prediction of the temperature and heat transfer in both the fluid and solid regions is essential to accurately predict the thermal and thermal-stress performance of the design. AIM now includes new features to support a comprehensive conjugate heat transfer analysis and one-way fluid-structure interaction to compute thermal-stress.

Predicting the correct flow field for compressible gas flows in the subsonic and transonic range is a critical design issue for many different applications. Industry applications include - high speed flow over airfoils or nacelles, and high-pressure flows in natural gas pipelines and valves. AIM now supports an accurate prediction of the flow field, variation of the gas density and thermal behavior for all compressible flow applications, which is critical for predicting the performance of a design.

In a range of structural applications, nonlinear contact is required to accurately predict deformation and stress in assemblies where multiple components are connected by interference fits, bolts, welds or are otherwise joined together. AIM includes robust nonlinear contact simulation using advanced solver technology for surface-to-surface contact combined with automatic contact surface detection and automatic nonlinear solution control.

AIM makes all of these simulation applications available to experts within one physics domain, as well as product designers who need to span multiple domains, making simulation more broadly applicable across different engineering disciplines

Due to the complexity of systems engineering, workflow and automation are critical. ANSYS 16.2 automates the overall approach to developing embedded software systems for avionics. A new systems development product, ANSYS® SCADE System Avionics Package™, simplifies systems design capabilities for the aerospace and defense industries. It delivers out-of-the-box templates for compliant design systems that are compliant with standard avionics protocols and operating systems, including: ARINC 653, ARINC 429 and AFDX configurations.

To accommodate the needs of a wide varieties of industries that require more customized workflows, ANSYS has added new capabilities in the Workbench platform and ANSYS Customization Toolkit (ACT) to customize simulation tools to accelerate the overall design process and workflows. ACT wizards provide customized simulation instructions and user interfaces to integrate any application in Workbench. These wizards span workflows across applications and guide the user through a single set of instructions.

Custom templates, as a part of the ACT enhancements, are also available in AIM to provide an authoring tool for highly automated and detailed simulation processes. These templates span the entire AIM workflow from geometry to results, as well as across all physics that may be a part of the simulation process. This critical capability enables multi-disciplinary teams to work effectively together and to deliver innovative advances across all disciplines of product design.

For more information, visit:

Thursday, 01 May 2014 09:59

ANSYS Acquires SpaceClaim Corporation

Written by

ANSYS (NASDAQ: ANSS), a global leader and innovator of engineering simulation software, announced today that it has acquired SpaceClaim Corporation, a leading provider of fast and intuitive 3-D modeling software for engineers, for a purchase price of $85 million in cash, plus retention and an adjustment for working capital. The transaction was closed on April 30, 2014.

Concord, Massachusetts-based SpaceClaim offers the first powerful and easy-to-use 3-D modeling tool that can be utilized by any engineer during the product development process. This process, called "direct modeling," differs dramatically from traditional CAD software, which is used by a relatively small percentage of engineers – typically late in the development process, to document the detailed design. SpaceClaim and ANSYS have partnered in the past to offer customers ANSYS® SpaceClaim Direct Modeler.

ANSYS' longtime vision is "Simulation Driven Product Development"™, in which organizations can derive tremendous value by harnessing computer simulation early in the design cycle to predict how a product will perform in the real world. With the addition of SpaceClaim, ANSYS will provide customers with a powerful and intuitive 3-D direct modeling solution to author new concepts and then leverage the power of simulation to rapidly iterate on these designs to drive innovation. The broad appeal of the SpaceClaim technology can help ANSYS deliver simulation tools to any engineer in any industry – at the earliest stages of the design cycle. ANSYS has always been an open platform and SpaceClaim's offerings are also CAD-neutral, allowing users to modify geometries regardless of the system in which they were created.

"This transaction is consistent with our strategic vision and M&A strategy, and accelerates our technological product roadmap to enhance our customer offering and drive growth," said Jim Cashman, president and CEO of ANSYS. "SpaceClaim is an exciting addition to our portfolio, as it addresses unmet 3-D modeling needs in the conceptual modeling, manufacturing and 3-D printing spaces, which represents an audience of 5 million users. In addition to driving innovation, the addition of SpaceClaim helps ANSYS accelerate the growth of the simulation market by broadening our user base from analysts and expert users to the millions of design and systems engineers in the industry. We welcome the SpaceClaim team to ANSYS."

"Leading companies know they need to modernize their engineering software and platforms if they want to develop truly innovative products," said Daniel Dean, senior vice president of research and development at SpaceClaim. "SpaceClaim's 3-D tools – combined with ANSYS' proven simulation software – are ideally suited to the rapid pace of today's business, driving a shorter product development process from concept to prototype."

In connection with the transaction, Goodwin Procter LLP is legal counsel to ANSYS.  Deutsche Bank Securities Inc. is exclusive financial adviser to SpaceClaim, and Latham & Watkins LLP is legal counsel.

Founded in 1970, ANSYS employs more than 2,600 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales locations throughout the world with a network of channel partners in 40+ countries.

For more information, visit:

Wednesday, 14 November 2012 09:55

ANSYS® Announces Version 14.5 Release

Written by

Building upon its comprehensive portfolio of advanced multiphysics engineering simulation technology, ANSYS (NASDAQ: ANSS) released version 14.5 to further support an integrated and streamlined approach to design exploration and the creation of a complete virtual prototype. New multiphysics capabilities are seamlessly brought together with the ANSYS Workbench platform to deliver unmatched engineering productivity and innovation.

In the real world, product performance varies by operating conditions, consumer usage, manufacturing processes and material properties. As products become increasingly complex, it is more challenging for engineers to fully understand the performance implications of design variations. Multiphysics simulation technology enables companies to make informed decisions based on insight gained from these analyses to deliver optimal results. Built on a platform that streamlines workflow among simulation applications, ANSYS 14.5 delivers many new and critical multiphysics solutions, enhancements to pre-processing and meshing capabilities as well as a new parametric high-performance computing (HPC) licensing model to make design exploration more scalable.

"It's no secret that while today's products are getting smarter, they're also becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having a holistic view of the product requirements and design is crucial to reduce design uncertainty and ultimately create a successful product. Our customers are depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to confidently predict how their products will perform and, at the end of the day, provide good value and satisfaction to their customers."

ANSYS 14.5 builds on a tradition of HPC leadership. The technology supports robust design exploration via a combination of Workbench's enhanced parametric simulation technology with improved job management and a new HPC licensing solution that enables scalable throughput computing.

Specifically, the new HPC Parametric Pack amplifies the available licenses for individual applications (pre-processing, meshing, solve, HPC, post-processing), enabling simultaneous execution of multiple design points while consuming just one set of application licenses.

To meet increasing market demands of higher performance, smaller size and lower-cost electronics, the design of electronic chips, packages and systems requires an integrated analysis and verification methodology. To resolve these challenges, ANSYS 14.5 introduces the first chip–package–system (CPS) design flow on the market. This coupled approach addresses multidisciplinary requirements from the first phase of the design process and results in a final product whose individual components work together as an integrated system.

ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache Design's integrated circuit (IC) power analysis products to ANSYS' electromagnetic field simulation products. Additionally, the power delivery network channel builder automatically connects electronic package models from ANSYS SIwave™ to IC power simulations in Apache's RedHawk™ and Totem™ for increased convenience.

Users of ANSYS 14.5 can create higher-fidelity simulation results faster. ANSYS TGrid™ functionalities are integrated in the ANSYS Fluent® environment in version 14.5 to further reduce pre-processing time. CAD readers and new advanced surface meshing capabilities are also integrated and available in a single user environment.  Additionally, meshing enhancements allow for higher-quality hexahedral meshes that result in smaller problem size and overall reduced solver time.

The use of composites parts across different industries is growing due to their ability to reduce the weight of a product. While many composites can be efficiently modeled as thin structures, some complex geometries, such as turbine blades, pressure vessels and automotive structures, require the setup of 3-D models and their inclusion within larger assemblies made of non-composites parts. ANSYS Workbench provides the necessary framework and streamlined workflow in version 14.5 to further improve the ability to create 3-D layered composites from complex geometry and conveniently combine them with non-composites parts in global assemblies.

Continuing its history of innovation in multiphysics, ANSYS 14.5 introduces extended fluid–thermal capabilities, such as two-way coupling between fluid simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS Maxwell®. The ANSYS Workbench platform supports the efficient coupling of multiple physics models and, when paired with this new feature, users can quickly and accurately predict losses and understand the effects of temperature on material performance in electromechanical devices such as motors and transformers.

A holistic solution for one-way thermal–fluid–structure interaction (FSI), ANSYS system coupling supports a wide variety of one-way thermal FSI workflows, which promotes higher-fidelity simulations. Furthermore, the robustness of coupled two-way force/displacement FSI is enhanced, allowing engineers to gain insight into their complete products more quickly and with less hassle. A global liquid food packaging and processing leader, Tetra Pak, has seen marked improvements with 14.5's new two-way FSI capabilities:

"Historically, simulating two-way FSI has been an incredibly time-consuming and complex process and, in some applications, not even possible," said Ulf Lindblad, technology specialist at Tetra Pak. "The solution stabilization algorithm implemented in ANSYS 14.5 broadens the range of applications where we can execute this difficult task with increased accuracy and efficiency. Designing our systems with optimized FSI will ultimately lead to improved machine performance for our customers and improved package performance for their consumers."

A systems-level engineering approach that brings hardware and software together earlier in the design process is crucial to avoiding design errors being introduced at a point when changes are costly.

With the integration of recently acquired ANSYS subsidiary Esterel Technologies' SCADE Suite with ANSYS Simplorer in version 14.5, companies can virtually validate power electronic and mechatronic systems earlier in the design process by simulating the embedded software with the hardware, including electrical, mechanical and fluidic subsystems. This capability increases the design fidelity and boosts confidence that products will perform as expected in the real world.

As companies face pressure to do more with their current engineering resources, ANSYS 14.5 further streamlines the design workflow and introduces ANSYS HFSS for ECAD. This capability contributes to accuracy by enabling engineers to run complex 3-D HFSS simulations directly from the ANSYS Designer layout-based interface and from other popular layout-based ECAD environments.

Scott McMorrow, director of engineering at Teraspeed Consulting Group LLC, has chosen to switch to ANSYS HFSS, ANSYS DesignerSI™ and SIwave after using a competitor's electromagnetic modeling and simulation products for nearly 10 years. "After a two-year extensive evaluation and measurement correlation of the ANSYS tools against multiple industry products, the measurement comparisons have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures. We found through detailed measurement testing that HFSS is truly the 'golden standard' in electromagnetic modeling. When the structures we measured were modeled faithfully and the material properties were characterized and entered accurately, ANSYS HFSS produced extremely accurate results with no discernible difference between measured and modeled results."

For more information, visit:

Wednesday, 05 September 2012 10:58

ANSYS Now Offering Simulation Technology to Students

Written by

U.S. college students can now take engineering simulation technology outside of the classroom with ANSYS® Academic Student, a new simulation solution derived from ANSYS' successful teaching software. This robust technology, which was released today, offers similar capabilities as the commercial solution at the affordable price of $25 for a one-year license. Eligible U.S. students can download the ANSYS solution used in their classroom on their personal computer, eliminating the physical restriction of having to be on campus to access the technology.

The simulation functionality built into Academic Student provides access to the same solvers and user environment in ANSYS' industry products. The inclusion of structural mechanics, rigid-body dynamics, fluid dynamics and multiphysics solvers addresses the fundamental educational needs of students across many disciplines, such as mechanical, aerospace, civil, chemical, biomedical engineering and physics. Students with multicore processors on their personal computers (up to a quad-core processor) can also benefit from the software's ability to run the solvers in parallel, allowing for more advanced simulations.

Mechanical and aerospace engineering students at Cornell University were among those selected to test ANSYS Academic Student on a trial basis prior to this launch. Rajesh Bhaskaran, Swanson Director of Engineering Simulation at Cornell, integrates simulation technology into courses across the Cornell Mechanical and Aerospace Engineering Program. "Not only is this powerful solution easy for the students to access both financially and physically, it's also valuable to our curriculum. It allows our students to apply the technology across several of their engineering courses to complete homework assignments and projects, which ultimately gives them a deeper understanding of the solution's capabilities," Bhaskaran said.

ANSYS Academic Student is sold and distributed online via the ANSYS Student Portal, which provides instant access to numerous learning tools, tutorials and training. ANSYS offers a full range of academic products suitable for both physical and distance learning as well as academic research. Future plans for Academic Student include making it available outside the U.S. market and linking to cloud computing to further increase its accessibility.

For more information, visit:

ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation, and Esterel Technologies S.A. ("Esterel") a leading provider of embedded software simulation solutions for mission critical applications, announced today that they signed a definitive agreement whereby ANSYS will acquire Esterel Technologies for a cash purchase price of approximately euro 42 million (or approximately US$53 million), subject to certain working capital adjustments at close. The agreement also includes retention provisions for key members of management and employees. Headquartered in Elancourt, France, Esterel has about 80 employees and reported revenues of approximately euro 15 million for fiscal year 2011. The transaction, currently anticipated to close in the third calendar quarter of 2012, is subject to customary closing conditions and regulatory approvals.

The Esterel SCADE solution enables software and systems engineers to design, simulate and produce embedded software, the control code built into the electronics in aircraft, rail transportation, automotive, energy systems, medical devices and other industrial products that have central processing units. Modern products are increasingly complex systems of hardware, software and electronics. For example, today's complex aircraft, rail and automotive products often have tens of millions of lines of embedded software code, from flight controls and cockpit displays, to engine controls and driver assistance systems. Esterel is often chosen when the embedded software is critical for safety and compliance reasons. Esterel provides software and systems engineers a solution to accurately model and simulate the behavior of the embedded software code to gain insight earlier in the design process and trace it to its requirements. Esterel solutions also reduce engineering time and cost by automatically generating certified and dependable embedded software code from these high fidelity models. Esterel certified code generators are currently compliant with more than 10 certification standards including aerospace, defense, rail transportation, automotive, industrial systems and nuclear plants.

The acquisition of Esterel complements ANSYS® software solutions by extending the ANSYS Simulation Driven Product Development™ vision to encompass both hardware and software systems.  A combined solution will enable customers to gain greater insight into the behavior of the embedded software as it interacts with the hardware (sometimes called the physical plant) including electrical, mechanical and fluidic sub-systems. The complementary combination is expected to accelerate development and delivery of new and innovative products to the marketplace while lowering design and engineering costs for customers and enhancing product safety. The combination of these two industry leading companies reaffirms ANSYS' commitment to deliver cutting edge, customer-driven solutions.

"We are very excited about the model-based embedded code simulation and production solutions Esterel adds to ANSYS, as well as the quality of its 230 global top-tier customers," said Jim Cashman, president and CEO of ANSYS. "Today's products are getting smarter. They have more electronics and software and this requires a systems engineering approach to product development. The combination of these two great companies will uniquely enable customers to comprehensively simulate complete systems and predict with confidence that their products will thrive in the real world. Further, we believe that the combination will foster innovation by gaining engineering insight across disciplines that have historically been silos."

"Both companies have a strong commitment to their customers and employees while sharing a passion for innovation and cutting edge technology," said Eric Bantegnie, co-founder, CEO and president of Esterel. "The complementary nature of software and hardware simulation provides key technological strengths that enhance our ability to deliver comprehensive, high-fidelity, world-class system simulation technologies that customers demand.  We believe Esterel customers will leverage the integration of our embedded software development products into a complete model-based systems engineering solution. This unique combination will reduce costly reliance on physical testing and streamline system engineering processes, while also improving the speed and success of our customers' product development efforts. Together we will meet the stringent requirements of upcoming certification standards, such as ISO 26262 in Automotive or DO-178C in Aerospace."

The two companies are developing integration plans that leverage and build on the cultural similarities and the best practices from each organization.

For more information, visit: or

ANSYS has launched the newest release of its engineering simulation technology suite, ANSYS® 14.0. Designed to optimize product development processes, ANSYS solutions reduce the time and cost needed to foster product innovations.

The advanced technology behind ANSYS 14.0 includes hundreds of new, advanced features that make it easier, faster and less costly for organizations to bring new products to market. The framework for the industry's broadest and deepest suite of advanced engineering simulation technology, ANSYS Workbench™, delivers unprecedented productivity. Tighter integration, for example, brings more physics applications together to power customers' simulation efforts, enabling them to predict with confidence that their products will thrive in the real world.

As a whole, ANSYS 14.0 delivers new benefits in three major areas:

Amplifying engineering: Companies are looking for ways to leverage their existing engineering resources. Engineers are most effective when they concentrate on making engineering decisions rather than performing manual and tedious software operations. ANSYS 14.0 automates many user-intensive operations, which helps product developers minimize time spent setting up problems.

Simulating complex systems: Today's products come with built-in complexity -- such as state changes, nonlinear phenomena and multiphysics interactions. Designs often combine hardware, electronics and software to form a complex system. This requires new approaches to engineering. The latest ANSYS release allows engineers to simulate such complexity as it exists in the real world, from a single component to entire systems, with uncompromising accuracy.

Driving innovation with high-performance computing (HPC): Competitive pressures demand faster and more frequent product introductions; at the same time, products must be innovative, desirable and high quality. Organizations can resolve these conflicting requirements only by evaluating a large number of design alternatives -- more rapidly than ever before. ANSYS 14.0 capitalizes on modern hardware advancements to deliver complex simulation calculations faster than other alternatives on the market today.

"Simulation-Driven Product Development™ has been a core theme of ours for some time. Using simulation, companies can analyze many design iterations early in the process, thus driving innovation. HPC is a key enabler to reduce design cycle times," said Jim Cashman, president and CEO of ANSYS.

Amplifying Engineering
Workbench at ANSYS 14.0 goes well beyond enhancing customized workflows, automatic parametric evaluations, and transparent sharing of common data between different applications. Embedded design optimization capabilities enable design of experiments as well as parametric and six sigma studies to reach the right design. Tools developed specifically to manage engineering simulation data are integrated for use across teams, groups and regions, preserving an organization's intellectual property. ANSYS 14.0 further opens the door for non-traditional users to gain full value from simulation.

In fluid dynamics, prior to setting up a simulation, engineers face the time-consuming task of creating a high-quality mesh. ANSYS 14.0 provides fast and robust capabilities to perform these tasks automatically. The assembly meshing tool extracts fluid volume from CAD assemblies and automatically creates structured Cartesian meshes or unstructured tetrahedral meshes, depending on user goals and preferences.

In the structural mechanics arena, simulating composites structures brings a number of challenges, such as defining hundreds or thousands of plies on a structure that includes various orientations, or analyzing potential failure ply by ply. The dedicated ANSYS Composite PrepPost™ tool provides significant ease of use for such models. ANSYS 14.0 tightly integrates Composite PrepPost with other structural simulation capabilities in Workbench.

When simulation results must be shared among physics, standard practice is to import data -- such as pressure fields, temperatures or heat exchange coefficients -- from external files. Automated algorithms provide an efficient tool to project the data from one mesh to another. In ANSYS 14.0, automated algorithms and weighting options have been enhanced to provide users with additional control and correction capabilities. "Using the ANSYS external data tool to import 3-D scan data, we are able to easily map the thickness of aerodynamic profiles onto 3-D models for static and modal analyses, as well as axisymmetric models for thermomechanical studies of our engines," said Herve Chalons, mechanical and structural analysis engineer at Turbomeca, a Safran company that develops helicopter engines. "The smoothing algorithms and control tools allow us to ensure the quality of interpolated data as well as the robustness of the mapping procedure. Ultimately, this easy-to-use tool will help us save time in setting up our simulation models."

Simulating Complex Systems
R&D teams must accurately predict how complex products will behave in a real-world environment. Only the ANSYS suite comprehensively captures the interaction of multiple physics -- structural, fluid dynamics, electromechanics and systems interactions -- with deep physics and from within a single simulation system.

A new ANSYS Fluent® cosimulation link with ANSYS Simplorer® allows engineers to analyze battery systems in Simplorer without neglecting nonlinear behavior of the fluid system. The cosimulation delivers high-accuracy results of multidomain system simulation using a fully integrated set of tools.

ANSYS 14.0 also introduces two-way electromagnetic coupling with stress analysis and the ability to re-simulate the electromagnetic field distribution on the deformed geometry. Applications include electrical machine, magnetic actuator and electric transformer designs in the automotive, aerospace, and power industries, for which accuracy of localized part deformations is important.

The successful design of many industrial processes depends on accurately predicting the dynamics of, and interaction between, different phases (gas, liquid, solid particles). Because of continuous progress in the area of multiphase modeling, ANSYS fluid dynamics capabilities at 14.0 widen the range of multiphase applications that can be simulated accurately, efficiently and robustly.

Applications that must consider complex nonlinear phenomena -- such as biomedical devices, hot rolled steel, acoustics and brake squeal -- can benefit from the suite's advanced models. For example, biomedical application developers access enhanced material formulations such as the Holzapfel model to capture behavior of fiber-reinforced tissue or shape-memory alloys for stent modeling. Moisture diffusion has been implemented in thermal, structural and coupled simulations for electronic components.

Driving Innovation with HPC
For enhanced insight, ANSYS 14.0 features a comprehensive suite of solver and HPC advancements across the entire range of physics. Smart solver management enhancements -- including architecture-aware partitioning -- evenly size and efficiently distribute jobs to available compute processors. "Petrobras relies on ANSYS software for its superior parallel scalability, together with advanced multiphase models and dynamic meshing," said Carlos Alberto Capela Moraes, technical consultant at CENPES (Petrobras Research and Development Center). "New enhancements such as architecture-aware partitioning and improved scalability will allow us to consider even more detailed, accurate and complete simulations than ever before -- yielding the kind of understanding that is essential to reproducing critical scenarios and complex operations of upstream processing systems in the oil industry."

GPU advancements are being leveraged to produce increased hardware performance. With ANSYS Mechanical™ 14.0, users can take advantage of the latest generation of GPU boards as well as minimize the amount of I/O required for post-processing operations. ANSYS is committed to staying synchronized with the latest computing technologies.

In a compressor or turbine, accurately capturing the transient interaction between rotating and stationary blades is complicated by the different blade count (or pitch) between different stage rows. This pitch change often means that a time-accurate simulation requires modeling the full wheel, a full 360 degrees of geometry -- a transient simulation that is sometimes computationally prohibitive. Users can dramatically reduce computation requirements, in terms of time and memory, with the new advanced transient blade row methods in ANSYS CFD™ 14.0. Only a few blade passages are required for simulation, yet results are highly accurate predictions of transient interactions.

In the antenna design field, an important research topic is analysis of finite-sized antenna arrays, which can provide beam-steering capability. Due to the structures' large size, rigorous analysis with full-wave 3-D simulators has been a challenge. An accepted method is to solve a single element of the array with a linked boundary condition, extracting performance of this single element effectively embedded in an infinite array. Because the method neglects edge effects from the true, finite size of an array, the results are approximations of far-field patterns and element-to-element coupling factors. The new finite array capability in ANSYS HFSS 14.0™, built upon the proven ANSYS domain decomposition and adaptive meshing technologies, models the finite array explicitly. The time- and memory-efficient HPC technique properly predicts the array's behavior including finite-size edge effects.

ANSYS 14.0 is available this week for customer download.

For more information, visit:

ANSYS, Inc. (NASDAQ: ANSS), a global provider of Simulation-Driven Product Development™, today announced that it has been named in Software magazine's listing of the world's largest software and services suppliers for the fifth year running. This year's Software 500 index positioned ANSYS at 107th place in recognition of 2010 revenues of $580.2 million.

The Software 500 is a revenue-based ranking of the world's 500 largest software and services organizations. This year's version is based on figures for total worldwide software and services revenues for the calendar year 2010, or closest fiscal year ending in 2010. Designed to assist software buyers, investors and stakeholders in their decisions, the index includes revenues from software licenses, maintenance and support, training and software-related services and consulting.

"We are immensely honored to be recognized in Software magazine's Software 500 list for the fifth year running, especially in such a volatile economic environment," said Jim Cashman, ANSYS president and CEO. "At a time when overall product integrity is emerging as an executive-level initiative, our steady growth is testament that organizations in a wide range of industries are strategically applying ANSYS engineering simulation software to deliver competitive product advantages."

ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations -- no matter their industry -- to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs more than 2,000 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 60 strategic sales locations throughout the world with a network of channel partners in 40+ countries.

For more information, visit: or

ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, and Apache Design Solutions, Inc., a leading simulation software provider for advanced, low power solutions in the electronics industry, announced today that they signed a definitive agreement whereby ANSYS will acquire Apache for a purchase price of approximately $310 million in cash, which includes an estimated $29 million in cash on Apache's balance sheet.  The agreement also includes retention provisions and incentives for key members of management and employees, earned over a three fiscal year period following closing, including an additional $13 million of performance equity awards.  When completed, ANSYS currently expects that the transaction will be modestly accretive to non-GAAP earnings per share in its first full year of combined operations.

ANSYS intends to fund the transaction with cash on-hand from the combined organization.  The transaction, currently anticipated to close in the third calendar quarter of 2011, is subject to customary closing conditions and regulatory approvals.  After the closing, Apache will become a wholly-owned subsidiary of ANSYS. 

Apache's software enables engineers to design power-efficient devices while satisfying ever-increasing performance requirements.  For example, smartphones continually add functionality to their platforms such as high definition video, GPS, video recording and conferencing with the consumer expectation that battery life will be extended.  Engineers use Apache's products to design and simulate efficient, low power integrated circuits for high-performance electronic products found in devices such as tablets, smartphones, LCD televisions, laptops and high end computer servers, to name a few.  The worldwide need for smart, energy-efficient electronics has never been greater while engineering challenges continually expand. Solutions to these engineering challenges rely on accurate, predictive simulation software.

The acquisition of Apache complements ANSYS' software solutions by bringing together best-in-class products that drive ANSYS' system vision for integrated circuits, electronic packages and printed circuit boards. The complementary combination is expected to accelerate development and delivery of new and innovative products to the marketplace while lowering design and engineering costs for customers.  The combination of these two industry leading companies reaffirms ANSYS' commitment to deliver cutting edge, customer-driven solutions in the 21st century.  With over 60 strategic sales locations and over 20 development centers on three continents, the combined company will employ approximately 2,000 people.

"We are very excited about the power-efficient design software that Apache adds to ANSYS' simulation capabilities," said James E. Cashman III, President and Chief Executive Officer of ANSYS.  "The addition of this technology will drive energy-efficient electronic product development in the 21st century.  Both companies have a strong commitment to their customers and employees while sharing a passion for innovation and cutting edge technology.  This combination will further strengthen and promote thought leadership allowing us to better serve our customers by accelerating the delivery of comprehensive, customer-driven engineering simulation solutions.  We see this as an opportunity to strengthen the ANSYS vision for solving chip, package and board design problems."

"The combination of these two great companies with emerging 3DIC technologies will lead to considerable advances within electronics," said Dr. Andrew T. Yang, co-founder, Chief Executive Officer and Chairman of the Board for Apache.  "The complementary nature of our electronic and thermal product offerings provides key technological strengths that enhance our ability to deliver comprehensive, innovative and world-class simulation technologies that customers demand." 


The two companies are developing integration plans that leverage and build on the cultural similarities and the best practices from each team.  ANSYS will provide additional details relative to the acquisition and integration activities subsequent to the closing of the transaction.

Due to the absence at this time of estimates of the acquisition-related impact of purchase accounting adjustments, including the allocation of the purchase price among goodwill, in-process R&D, other intangibles, deferred revenue and equity-based compensation expenses, ANSYS is currently unable to provide GAAP estimates on future earnings.  The company intends to provide updated GAAP and non-GAAP financial guidance after the closing of the transaction.


In connection with the transaction, Deutsche Bank Securities Inc. is acting as exclusive financial advisor to Apache, and O'Melveny & Myers LLP (Menlo Park office) is acting as legal counsel.  BofA Merrill Lynch is acting as ANSYS' financial advisor and ANSYS retained Goodwin Procter LLP as its legal advisor.

Conference Call and Webcast

ANSYS will hold a conference call today to discuss this announcement.  The Company will also provide its prepared remarks and related materials on the Company's Web site and as an exhibit to its current report on Form 8-K dated June 30, 2011 in advance of the call to provide stockholders and analysts with additional time to review the materials in preparation for the conference call. The conference call will include brief overview comments regarding the transaction, followed by questions and answers.  The prepared remarks will not be read on the call.

Conference Call Date:  June 30, 2011

Time:  11:30 a.m. Eastern (8:30 a.m. Pacific)

Toll free Dial in #: 877-883-0383 (US), 877-885-0477 (Canada) or 412-902-6506 (Int'l)

Passcode: 5239686

The call will be recorded and a replay will be available approximately one hour after the call ends. The replay will be available for one week by dialing 877-344-7529 (US) or 412-317-0088 (Canada & Int'l) and the passcode is 451889. The archived webcast can be accessed, along with other information, on ANSYS' Web site at  A presentation describing the transaction will also be made available on the ANSYS Web site at

ANSYS is currently in a quiet period and will not be accepting phone call or meeting requests following today's public conference call and webcast.

As the DoD reallocates spending, it is clear that traditional product and capability development must adapt to support the warfighter at current levels using fewer resources.

Warfighter capability requirements rapidly change and support organizations must be equipped to respond with agility and accuracy. Advances in modeling and simulation provide researchers, test directors, and engineering managers with the tools to create necessary technology at a reduced cost and in a shorter timeframe.

ANSYS, Inc. offers these tools by developing, marketing, and supporting engineering simulation software used to predict how product designs will operate and how manufacturing processes will behave in real-world environments.

In order to address this timely issue, ANSYS, will sponsor IDGA’s Engineering Simulation for Military Technology Summit. The Summit will present best practices from forward thinking organizations along with technology and processes to improve the speed of capability development from research to fielding.

During the main summit, Robert Harwood, Ph.D., Aerospace and Defense Industry Director of ANSYS, will discuss the Impact of Engineering Simulation of Research, Development, Test and Engineering.

Hear from other key leaders including:

* Mr. Russell Howard, SES, Director of Engineering and Technical Management, Air Force Materiel Command
* Col William Cooley, USAF, Materiel Wing Director, Space Vehicles, Commander, Philips Research Site, Air Force Research Laboratory
* Dr. James Elele, Branch Head, BMVV (, M&S IPT Lead, T&E, PMA-261, Battlespace M&S Division, NAVAIR
* William Urschel, Chief Architect, Aeronautical Systems Center, Air Force Materiel Command
* Mr. Scott Alexander, Director, Modeling and Simulation Program, Missile Defense Agency

For more information on speaking, exhibiting or attending the Engineering Simulation for Military Technology Summit, visit:

For specific electromagnetic applications in the healthcare industry, HFSS™ software from ANSYS (Nasdaq: ANSS) can now provide proof that a biomedical device transmitter design meets Federal Communications Commission (FCC) standards -- a ruling that will enable medical device developers to cut development time and costs while meeting safety standards.

The FCC ruled in February that the finite element method (FEM) is a valid technique to simulate a medical device that must communicate with other similar devices. As a result, organizations in the medical equipment sector can use HFSS -- industry-leading FEM electromagnetic field simulation -- to validate their transmitter designs.

Today's sophisticated medical implants and other equipment often contain transmitters that communicate with other devices -- transferring physiological data to a doctor via wireless communication, for example, which can be used to monitor, diagnose or treat a patient's condition. The new FCC ruling applies to transmitters that are placed inside, on, or in close proximity to the human body. Developers of such medical devices must ensure that their equipment meets radio frequency (RF) emission safety standards. Additionally, manufacturers must comply with specific absorption rate (SAR) regulations, a measure of how the body absorbs energy when exposed to an RF electromagnetic field. HFSS software -- which employs FEM simulation to verify both SAR and RF emissions -- can also reduce development time and costs while increasing reliability and design optimization.

"The HFSS finite element solution is extremely valuable for designing antenna systems for implantable devices," said Mark Lanciault, principal electrical engineer, Cambridge Consultants, Inc. "Its use of an unstructured mesh is particularly well suited for modeling the complex curved surfaces within the human body, as seen in organs, tissues, and bones. Using HFSS allows us to optimize and verify performance of our implanted antenna designs in a representative environment. We will now be able to provide our customers accurate solutions specific to their device's location in the body."

"The medical device market is rapidly innovating to meet consumer demands and satisfy regulatory safety requirements," said Markus Kopp, product manager for electronics at ANSYS. "This FCC ruling allows researchers to innovate with HFSS, developing new approaches that they can get to market faster -- yet also maintain the FCC's high standards of technical compliance. Beyond that, the ultimate beneficiary is the public, who will have quicker access to life-enhancing medical devices."

ANSYS requested that the FCC grant a waiver to the Medical Device Radiocommunication Service rules to permit FEM environmental evaluation of medical implant or body-worn equipment. The ruling granting the waiver cited scientific literature stating that FEM is a sound engineering technique.

HFSS software, which incorporates industry-leading technology for 3-D full-wave electromagnetic field simulation, enables engineers to design, simulate and validate the behavior of complex high-performance RF, microwave and millimeter-wave devices in next-generation wireless devices, defense communication systems, biomedical devices, and consumer electronics.

For more information visit:

ANSYS (NASDAQ: ANSS), a global innovator of engineering simulation technology, and SpaceClaim®, the leader in 3D Direct Modeling solutions for rapid concept design and geometry manipulation, today announced significant new enhancements to ANSYS® SpaceClaim Direct Modeler software. Since 2009, SpaceClaim has been available as an option to ANSYS customers, and this new version further enables simulation engineering teams to address business, engineering, and geometry issues in 3D.

ANSYS recently released ANSYS 13.0, the latest version of its engineering simulation technology suite. ANSYS SpaceClaim Direct Modeler 2010 SP1, which is compatible with ANSYS 13.0, brings 3D solid modeling to analysts who work in a 3D world but do not want to become experts in traditional, feature-based CAD systems. It enables product development and design engineers to create and modify 3D geometry models without needing to learn complex and expensive CAD systems. As a result, simulation can be conducted earlier in the product development process, where it can have the most impact on performance, cost, and time-to-market.

"The latest version of ANSYS reflects our continuing commitment to provide significant competitive advantages for our users while allowing them to apply the software in a manner that fits their internal processes," said Jim Cashman, ANSYS president and CEO. "ANSYS SpaceClaim Direct Modeler is a critical tool for users to create, edit and simplify geometry models in a way that is best suited for simulation. Customers have adopted the technology at a rapid rate."

SpaceClaim's flexibility, ease of use and compatibility with traditional CAD products has helped thousands of users productively apply 3D to concept modeling, bid modeling, and model preparation. Throughout the supply chain, manufacturers are improving how they do business by leveraging SpaceClaim.

"ANSYS continues to be a leading technology innovator, making it easier, faster, and cheaper to bring new products to market through the evolution of Smart Engineering Simulation," said Chris Randles, SpaceClaim President and CEO. "Our partnership with ANSYS is empowering engineers worldwide with new levels of design and simulation flexibility. In this economic environment, manufacturers are relying on solutions that will cost-effectively enable their engineering organizations to continue to drive innovative products that create market demand."

The new functionality in ANSYS SpaceClaim Direct Modeler 2010 SP1 includes:

* New SpaceClaim designs can be directly created and edited from the ANSYS® Workbench™ project schematic
* Simultaneous associativity capabilities now automatically update parameters and name selections between SpaceClaim and ANSYS Workbench
* Enhanced repair features make cleaning up dirty geometry easier than ever
* Automatic inlet and outlet detection algorithms further expedite volume extraction
* Beam modeling supports cross-section optimization
* A new extend tool supports trimming and extending between curves and surfaces to facilitate beam and shell modeling

One customer using ANSYS SpaceClaim Design Modeler is Schramm, Inc., which provides global customers with land-based hydraulic drill equipment for mining, energy, geothermal and other applications. "An important part of Schramm's competitive advantage is our ability to be at the forefront of technology and drilling industry standards," said Thomas Ronge, mechanical engineering lead, Schramm. "We have progressively improved the function and quality of our products to provide world-class performance and reliability. Advanced tools such as ANSYS SpaceClaim Direct Modeler provide us with the ability to easily and quickly design and prepare models for simulation as we create new drill rig products or customize products for customer requirements."

About ANSYS, Inc.
ANSYS, Inc., founded in 1970, develops and globally markets engineering simulation software and technologies widely used by engineers, designers, researchers and students across a broad spectrum of industries and academia. The company focuses on the development of open and flexible solutions that enable users to analyze designs directly on the desktop, providing a common platform for fast, efficient and cost-conscious product development, from design concept to final-stage testing and validation. The company and its global network of channel partners provide sales, support and training for customers. Headquartered in Canonsburg, Pa., U.S.A., with more than 60 strategic sales locations throughout the world, ANSYS, Inc. and its subsidiaries employ more than 1,600 people and distribute ANSYS products through a network of channel partners in 40+ countries. Visit for more information.

About SpaceClaim Corporation
SpaceClaim enables global engineering and manufacturing organizations to leverage 3D design to innovate, win more business, and get products to market faster. Engineers can rapidly create new designs as well as manipulate and simplify 2D and 3D CAD data, regardless of origin and without the complexity of traditional CAD. Customers include Nokia Siemens Networks, BorgWarner, Medtronic, Lotus Cars, Sharp, K2 Medical Systems, FuelCell Energy, Emhart Glass, GE Aviation, General Dynamics, and the U.S Navy. SpaceClaim is privately held and backed by Borealis Ventures, Kodiak Venture Partners, and North Bridge Venture Partners. For more information on SpaceClaim, please visit

ANSYS, ANSYS Workbench, Ansoft, AUTODYN, CFX, FLUENT, and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. SpaceClaim is a registered trademark of SpaceClaim Corporation. All other brand, product, service and feature names or trademarks are the property of their respective owners.

Barbara Ewen
(781) 672-3114
This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Bernie Buelow
SpaceClaim Corporation
(978) 482-2211
This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Fran Hensler
This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Annette Arribas
This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Source: SpaceClaim

News Provided by Acquire Media

Copyright © 2019 Prototype Today ®. All rights reserved.

|   Privacy Policy |   Terms & Conditions |   Contact Us |

All trademarks and registered trademarks are the property of their respective owners.

Additive Manufacturing Today