Longview Announces New Management Forum in Conjunction with 2011 3D Collaboration & Interoperability Congress

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced a new, special forum for executive management in conjunction with the 2011 event, to be held May 23 to 25 in Denver, Colorado. The new Management Forum will cover topics of particular interest to executives managing processes and people for more effective global collaboration in product development and manufacturing. The following topics are currently on the agenda for this year’s forum:

* Teamwork, Social Computing and Their Impact on Simulation Driven Design?
* Managing the Braindrain Threat from Boomer Retirement
* Irreconcilable Differences? Getting Engineers from Different Generations To Work Together
* Mashups: A Killer App for Engineers?
* Is PDM-Less PLM Pragmatic or Problematic?

This first year’s Management Forum will be hosted by Chad Jackson, a recognized authority on design and engineering in new product development, with more than 15 years of experience in the industry. “I'm excited to host the new Management Forum at CIC,” said Jackson, president of Lifecycle Insights Inc. “There are a lot of issues that are mission-critical to executives managing organizational performance. Our new forum is targeted squarely at these types of issues.”

Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.

Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systèmes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek, Mecanica Solutions, mental images, Parametric Technology Corp., Right Hemisphere, Spatial, Technigraphics, Techsoft 3D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.

Visit the web site www.3dcic.com to find out more about the event, what past attendees had to say, and why you should attend, and for free access to all presentations and audios from the 2010, 2009 and 2008 events.

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