Longview Advisors Announces 2013 3D Collaboration & Interoperability Congress

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC), is proud to announce its 2013 event, which will be held May 21-23 at the Cheyenne Mountain Conference Center in Colorado Springs, Colorado.

3DCIC is dedicated to fostering and improving collaboration and interoperability in product design, development and manufacturing.

Now in its tenth year, CIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from automotive, aerospace, heavy equipment, electronics industries, as well as with representatives from government and defense communities. 3DCIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing.

Organizers are pleased to announce that NASA/ESA (European Space Agency) is merging with 3DCIC and will hold their 14th annual product data meeting at 3DCIC in 2013 and thereafter.

“Collaboration and interoperability present some of the toughest impediments to improving manufacturing competitiveness,” explains David Prawel, president of Longview Advisors and program chair of the congress. “It’s about people working together to build better products faster, with higher quality – topics squarely in our sights at 3DCIC.”

For anyone interested in viewing presentations and audio from past events, all content is now freely available

For more information, visit: www.3DCIC.com

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