2014 3D Collaboration & Interoperability Congress

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC), is proud to announce its 2014 event, which will be held May 28-30 at the Cheyenne Mountain Conference Center in Colorado Springs, Colorado.

3DCIC is dedicated to fostering and improving collaboration and interoperability throughout the product lifecycle. Now in its eleventh year, 3DCIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from a broad array of commercial and defense industries, as well as with representatives from government. 3DCIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions across all sectors of discrete manufacturing.

Organizers are pleased to announce that NAFEMS (the International Association of the Engineering Modeling, Analysis and Simulation Community is holding their biennial American conference in conjunction with 3DCIC 2014. In addition, the PDES Board of Directors will again hold their annual meeting at 3DCIC and the 3D PDF consortium will be joining again for its third annual meeting.

“For decades, executives have understood that the seamless integration of design, analysis/simulation, manufacturing, downstream operations and the supply chain is the key to effective global business. It’s the core of the PLM vision,” explains David Prawel, president of Longview Advisors and program chair of the congress. “Making this work requires highly trained people, sharing information in efficient processes, supported by world-class technology. This is what 3DCIC is all about.”

“Engineering simulation continues to increase its penetration in to all aspects of the product lifecycle,” commented Tim Morris, NAFEMS CEO. “Integration with systems engineering and the use of multi-disciplinary technologies are gaining pace. At the same time, OEMs now delegate more engineering, and hence simulation, to suppliers. Systems level requirements must be cascaded down the supply chain, and simulation results delivered back up to systems integrators. The need for understanding of interoperability and collaboration issues is paramount. Aligning the NAFEMS and 3DCIC conferences will provide attendees with an unparalleled opportunity to explore, debate, discuss and understand these topics.”

For more information or to register, visit: www.3DCIC.com

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