IPC APEX EXPO to Feature 35 Technical Sessions & 100 Research Papers

Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO® Technical Conference on February 19-21, 2013, at the San Diego Convention Center, will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

“Conference attendees this year will find a lot of sessions that pertain directly to issues and concerns with production on the factory floor,” says IPC Technical Conference Director Greg Munie, Ph.D. “We have sessions covering defects like pad cratering and head on pillow; voiding; bare board testing and reliability; and rework for high-reliability assemblies. The information presented will reveal new paths and solutions for companies to take.”

Over three days, 35 technical sessions with nearly 100 research papers will address additional topics such as military electronics, advanced packaging, fluxes and paste, embedded devices, high-frequency electronics and electrostatic discharge. In addition, the areas of rework/repair, cleaning, assembly reliability, solder and alloy reliability, printing and printed electronics will have multiple sessions due to the wealth of information available.

“Printed electronics remains a growing and soon-to-be ubiquitous technology. One of the great benefits of the technical conference is the opportunity to network, ask questions and get answers to challenges across the supply chain,” Munie adds.

For more information, visit: www.IPCAPEXEXPO.org/conference

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