IPC Announces Summer Webinars

IPC announces Summer Webinars for June, July and August 2011. Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organizations cost-effective opportunities to bring important new information directly to their conference rooms.

The following webinars will run from 10:00 am to 11:00 am Central time:

Assembly Guidelines for Pin in Paste Process
Guhan Subbarayan, Ph.D., Cisco Assembly Sciences and Technology Team
Wednesday, June 15, 2011

PCB Design and Assembly Process Planning for QFN and Other Bottom Termination Components
Vern Solberg, STC Madison
Thursday, June 23, 2011

Conflict Metals: How This Issue Will Affect Your Business
Tony Hilvers and Fern Abrams, IPC
Monday, July 11, 2011

A New Method Measuring Conformal Coating Adhesion
Chris Hunt, Ph. D., National Physical Laboratory (NPL)
Wednesday, July 13, 2011

Cleaning Highly Dense Circuit Assemblies and Advanced Packages
Mike Bixenman, DBA, Kyzen Corporation
Tuesday, July 19, 2011

Printed Electronic (PE) Circuit Process for LED Interconnection
Mike Dubois, Caledon Controls
Wednesday, July 20, 2011

A New Approach for Early Detection of PCB Cratering Failures
Anurag Bansal, Ph.D., Cisco Systems
Wednesday, July 27, 2011

DFM — Design for Manufacturing
Cheryl Tulkoff, DfR Solutions
Wednesday, August 3, 2011

ITAR Compliance Basics and Cyber Security for Level 3 Manufacturers
Bob Richardson and John Burton, TeamITAR™
Tuesday, August 9, 2011

Effects of Flux Residues on Reliability
Eric Bastow, Indium Corporation
Wednesday, August 10, 2011

The registration fee for each webinar is $75 per login for IPC members and $100 per login for nonmembers. An organization can stretch its staff development budget by training multiple employees in a conference room, equipped with a speakerphone and projector.

For more information and to register, visit: www.ipc.org/summer-webinars

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