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Advanced Engineering 2018, the UK’s largest exhibition for advanced engineering professionals, is celebrating its 10th birthday by being bigger and better than ever, according to show organisers Easyfairs. New for this year is the Nuclear Engineering zone.

This builds on the success of the 2017 exhibition, where attendance increased by 15% on the previous year. Visitors stayed on average just under three hours at the show, many looking for new products and services.

The other show zones are: Aerospace Engineering, Composites Engineering, Automotive Engineering, Performance Metals and, building on its hugely successful 2017 launch, Connected Manufacturing. In addition, the Enabling Innovation showcase is being repeated this year. It provides a unique opportunity for 50 start-ups & researchers to showcase the next generation of exciting new technologies.

As last year, the exhibition will be held in halls 2, 3 and 3A, though now there are two entrances to the Show, making navigation of the huge exhibition space easier.

The Show, and its exhibitors, are marketed heavily with 85 key industry associations and media partners. It is publicised widely, with 2.6 million people reading about it in printed magazines, 3.4 million people learning about it through social media and 2.1 million people viewing the Advanced Engineering website per month.

Last year the UK’s largest meeting place for advanced engineers attracted some of the industry’s biggest names including Airbus; Boeing; Jaguar Land Rover; Hexcel; and Dassault Systèmes, who met and did business across the supply chain, with visitors from a range of engineering specialisms including: automation, design & test engineering, process control, machining and many more.

The two-day open conference, which is accredited by the CPD Accreditation Service ‘Continuing Professional Development (CPD)’, will have a raft of high profile speakers and topics. Visitors will see variety of cutting edge technology and materials from exhibitors as well as show floor features.

Alison Willis, industrial divisional director at Easyfairs, organisers of the show, said: “Happy 10th birthday to the Advanced Engineering Show! We have hit double figures and are expecting a record response from visitors and exhibitors this year.

“The new Nuclear Engineering zone will tap into the technical excellence of this high growth sector, addressing nuclear energy new-build, operation and supply chain. This has huge importance for the energy security of the country, and provides a great opportunity for companies to join a new and dynamic supply chain”

What did some of the exhibitors and visitors have to say?

John Darlington, exhibitor TenCate’s Global Director Product and Market Strategy, said: “The Advanced Engineering show is a fantastic opportunity to support our industry partners when meeting new clients. Last year was no exception, and indeed has been the most successful ever, delivering more leads, more contact with suppliers and, as importantly, the ability to meet TenCate’s existing customers and partners.”

Robert Slade, Automotive Consultant, Mackenzie Jones Engineering, said: “An excellent show for networking and very important for my company. We visit every year. It was enjoyable and worthwhile.”

Roz Bird, Commercial Director of Silverstone Park, commented: “The Advanced Engineering Show has exceeded our expectations – hosting the VIP Lounge in the middle of such a big industry event and offering people the chance to chat over coffee in informal and comfortable surroundings was one hundred per cent the right thing to do. It’s made for a brilliant couple of days of networking. In fact I have always thought the show has the right sort of audience for us in terms of advanced engineering, electronics and software development and that has proven to be very true.”

Chris Mason, Head of Sales at Ensinger, said: “We’ve been exhibiting for seven years now. The show continues to grow and generate high quality leads from a wide range of sectors,”

Colin Williams, Materials Engineer at Blatchford Products said: “A great opportunity to meet current and future suppliers, all in one place.”

W Griffiths, Technology Consultant Indestructible Paint, said: “A very good show, lots of interest shown and plenty of enquiries.”

Wayne Walker, North American Operations Manager at Pathfinder Cutting Technology LLC, said: “Advanced Engineering … is a must do show for companies wanting to exhibit their technology to the UK’s vibrant high-tech manufacturing industries. There is a real buzz about manufacturing in the UK. I highly recommend this show.”

The show takes place on the Oct 31st & Nov 1st , at the NEC, Birmingham, UK.

EPMC formerly LVMC has been running for over a decade and is the premier technical conference in Europe dedicated solely to the use of precision dimensional measurement technology for process improvement for manufacturers.

Following the success of the event in 2017, EPMC will be returning to the Ricoh Arena in Coventry for 2018.

EPMC is a rare opportunity to see presentations on real world applications from leading industry experts and academics, as well as to view the latest equipment from the world’s best suppliers, network and share ideas and of course, increase overall awareness of European and worldwide industries. The event will follow a similar format of a combination of immersive seminars, exhibition, networking functions and the metrology stadium.

With the attendance of industry professionals from major manufacturing OEMs, EPMC is the foremost conference and exhibition to attend to discuss real world metrology applications with like-minded individuals.

Conference topics will cover:

  • Developments in metrology education
  • Automation of metrology applications in shop floor environments
  • Novel and unusual adaptations and applications of existing metrology technology
  • Developments that will lead to the future of metrology
  • Discussions of the challenges and needs of the dimension metrology community

The committee members are:

  • Carl Baines, Brunson (Chair)
  • Simon Cheetham, BAE Systems
  • Carl Hitchens, Nuclear AMRC
  • Andrew Hockenhull,  Airbus
  • David Homewood, FARO
  • John Kane, Wyvern Industrial Technology
  • Steve Shickell, NMS 3D UK
  • Trevor Toman, Coventry University

The event is self-financing and is run not for profit, and its future is dependent upon the support of exhibitors and delegates who attend each year.

Interested in exhibiting? Please click here for more information

Delegate registration is now open. Click here to register for EPMC 2018

Advanced composite materials manufacturer Hexcel celebrated the grand opening of its state-of-the art manufacturing facility at the MidParc Free Trade Zone in Casablanca. The opening ceremony was attended by Mr Moulay Hafid Elalamy, Minister for Industry, Trade, Investment and Digital Economy; Nick Stanage, Hexcel Chairman, CEO and President; and Thierry Merlot, President, Aerospace – Europe/Asia Pacific/MEA.

At the new $20 million facility, Hexcel transforms lightweight honeycomb materials into engineered core parts that provide structural reinforcement for aerospace applications including aircraft structures, engine nacelles and helicopter blades. The site is expected to employ more than 200 people by 2020, and it made its first customer delivery last December.

The Moroccan plant is part of Hexcel’s ongoing worldwide investment to create a diversified and robust global supply chain to support aerospace customers’ growing demand for engineered core. In recent years, Hexcel has increased capacity at existing plants to support its engineered core business and plans further expansions to capture additional opportunities in a global market with excellent growth potential.

At the ceremony, Hexcel’s Nick Stanage commented: “We could not be more pleased to become neighbors here in Midparc with our customers including Airbus, Boeing, Safran and Bombardier. This facility is critical to our success because it positions us to secure additional growth with our aerospace customers in Morocco and around the world,” he said.

Mr Elalamy commented: “The Aerospace sector is achieving its potential in terms of export business and local integration, following the launch of the Industrial Acceleration Plan. The recently launched “engines” and “composite materials” ecosystems add significantly increased value that Hexcel will support and reinforce. The company is the driving force of the “composite materials” ecosystem, and its business is sure to encourage other structural investments to the region,” added M. Elalamy.

It’s that time of year again – time to think about entering Mastercam’s Wildest Parts competition. This year, Mastercam is offering two different competitions open to any current student, team of students, or instructor programming with Mastercam to participate in.

Students worldwide can enter their “wildest” part made in school this year to Mastercam’s Wildest Parts Competition and get a chance to win $1000 and other prizes. The Wildest Parts Competition is an annual contest, sponsored by CNC Software, Inc. — developers of Mastercam® — where students can submit any part they cut during the school year. The deadline for entries is June 30, 2018.

Last year, the winning students were Grayson Weber from Capital High School in Helena, Montana who made a survival multitool and Christian Ziruk from Washington State University in Pullman, Washington who made a deep sea AUV camera enclosure.

“We look for high quality, original parts that haven’t been made before, or parts that are familiar yet feature a unique, new design. We like eye-catching designs that would look nice on a display, because we do show them off at educational trade shows,” says Michelle Nemeth, Marketing Specialist at CNC Software. “We’re always impressive by how innovative students can be with Mastercam, and we encourage students to really think beyond the norm. They may create something specifically to enter into the competition — or have already made something in school that would qualify.”

Wildest Parts IMTS Edition:

This year, CNC Software, Inc., partnered with the Gene Haas Foundation, Haas Factory Outlet Chicago, and Haas Automation for a specific IMTS challenge. Entrants must submit an aerospace/rocket themed part to compete for up to $1,000 from Mastercam and $1,500 towards a scholarship for continuing education from the Gene Haas Foundation. The deadline for entries is June 30, 2018.

IMTS is the International Manufacturing Technology Show held in Chicago. IMTS includes the Smartforce Student Summit for elementary through college students to learn about opportunities in manufacturing. The winning students and their parts will be celebrated at the Smartforce Student Summit in the Haas and Mastercam booths at IMTS.

Kathy Looman from Gene Haas Foundation says, “This year, as we were planning our IMTS Student Summit presence, we decided it would be very cool to have a contest like Mastercam’s Wildest Parts Competition. Not only could talented students design and build projects, they would be able to inspire their peers by having the projects displayed at IMTS. So, we asked Mastercam if we could join forces this year, and the rest was history!”

Important rules for contestants:

  • The parts must be programmed with Mastercam.
  • For the IMTS competition, the part must be machined on a Haas machine.
  • All entries must be created during the 2017-2018 school year.
  • Applicable logos must be engraved on the part.
  • Part must be smaller than 1 cubic foot, less than 42 inches long, and less than 16 inches tall.
  • No weapons or weapon replicas.
  • All designs become property of CNC Software, Inc.
  • The part should not be painted in any way that obscures the quality of the machining.
  • If three or fewer parts are entered in one division, CNC Software reserves the right to award  prizes as it sees fit.
  • All entries must be received by June 30, 2018. Parts should be packaged well to avoid damage during shipment.

The fifth annual Hackaday Prize, a global competition that challenges makers, engineers and designers of all backgrounds to "Build Hope" through open source hardware projects launched. Sponsored by Digi-Key and Supplyframe, the 2018 Hackaday Prize follows suit from last year's competition by splitting up the seven-month-long contest into five themed challenges that run five weeks each from March 12 to October 8.

The first round of the competition is the "Open Hardware Design Challenge," where entrants are encouraged to design the boldest plan they can dream up. Prototypes are not necessary for this challenge - only pictures, charts and theory are required. The Open Hardware Design Challenge runs through April 23.

The remaining rounds are the "Robotics Module Challenge" (April 23-June 4), "Power Harvesting Challenge" (June 4-July 16), "Human-Computer Interface Challenge" (July 16-August 27) and the "Innovative Musical Instrument Challenge" (August 27-October 8). 

"We're excited to partner with Hackaday for another year of challenging inventors to be curious, creative and determined. The Hackaday Prize contest aligns with Digi-Key's vision to encourage and enable innovation in technology that will solve problems and advance civilization. With the amazing projects we've seen in previous years, we can't wait to see what the entrants create this year," said David Sandys, director, Business Ecosystem Development at Digi-Key.

The top 20 entries from each challenge will win $1,000 and be considered for the Finals Round. The top five finalists, including the Grand Prize winner, will be announced at the Hackaday Superconference taking place November 2-3, 2018 in Pasadena, California. 

The Grand Prize winner will be awarded $50,000 and considered for a residency at the Supplyframe DesignLab in Pasadena, California. The second-, third-, fourth- and fifth-place winners will receive $20,000, $15,000, $10,000 and $5,000, respectively. 

In addition to cash prizes, participants will compete throughout the competition for most impressive, outlandish and otherwise notable projects. Although there is no cash value associated with these accomplishments, they do come along with bragging rights. Examples of possible Achievements include the Diva Plavalaguna Achievement (most unexpected musical instrument), the Sonic Screwdriver Achievement (hacks that seemingly do everything) and the Ender's Achievement (most incredible student submission). 

Hackaday awarded the 2017 Grand Prize to Alex Williams, inventor of the Open Source Underwater Glider - a low-cost, autonomous glider capable of long-term underwater exploration of submarine environments. Previous winners include the creators of the Eyedrivomatic, a device that allows wheelchair users to drive the wheelchair with just their eyes, and Dtto, a modular self-reconfigurable robot designed for all-terrain search and rescue operations.

The 2018 Hackaday Prize judges represent the best and brightest in the engineering and maker communities, including Sherry Huss, co-creator of Maker Faire; Mark Rober, a former NASA engineer and incredibly popular YouTuber; and Danielle Applestone, CEO of Bantam Tools.

Individuals or teams from the USA, U.K., India and many other countries are eligible to enter. Universities, colleges, hackerspaces and startups are strongly encouraged to take part, as are young hackers. Applicants must be 13 years of age or over to participate.

Team Penske and Siemens have entered into a new technical partnership. Under the multi-year agreement, Siemens will help enhance Team Penske’s performance with full access to a wide variety of software products to enable advanced digital design and simulations. Team Penske race teams will utilize Siemens’ software across their computer-aided design (CAD), engineering, simulation and machining platforms. Utilizing this software, Team Penske can create a digital twin of their race cars, which can help engineers simulate engine configurations, innovate new parts and predict race results in real-time. 

“Team Penske is excited to welcome Siemens as a key technical partner, beginning with the 2018 season,” said Roger Penske. “Siemens is a company and a brand that is known worldwide for its superior technology and engineering. Our teams will benefit from Siemens’ expertise and support and we look forward to helping grow the Siemens footprint in the world of motorsports.”

Team Penske is partnering with Siemens PLM Software to adopt an integrated virtual environment for digital modeling and simulation. Siemens’ PLM tools allow Team Penske to keep large amounts of data well organized and accessible for review by anyone within the team, and also enables engineers to quickly iterate through design concepts with the digital twin to arrive at near-optimum solutions within a high-intensity, short timeframe environment. The digital twin is the key to making effective, data-driven design changes at a very rapid pace, and thus, helping improve the results at the racetrack every week.

“We are proud to team up with Team Penske, an American icon in motorsports. As a racing team with extremely challenging requirements on development time and accuracy, Team Penske will be able to fully leverage the unique capabilities of our software solutions,” said Lisa Davis, Managing Board member of Siemens and CEO of Siemens USA. “Our integrated industry solutions, combined with the expertise of the entire design and racing team from Team Penske, will help create world-class vehicles.”

Utilizing Siemens’ PLM tools allows Team Penske to quickly analyze thousands of electronic data streams full of critical on-track performance information, and apply changes to the race car’s digital twin. These changes are then reviewed for performance and durability in a virtual environment, which allows low-cost, high fidelity simulation of the results. With Siemens’ technology, Team Penske is able to capitalize on this streamlined digital process and quickly transition to the physical stages of manufacturing, quality assurance, installation onto the race car, and validate performance in the physical environment. This entire process can be completed with high-impact components in as little as a few hours.

“We are excited to partner with Team Penske and be a part of their strong legacy of championship racing,” said Tony Hemmelgarn, president and CEO, Siemens PLM Software. “We look forward to supporting Team Penske with our software to help streamline designs, speed results, and deliver the most successful racing teams yet.”

The partnership will also include Siemens as an associate sponsor on the Team Penske cars competing in the Monster Energy NASCAR Cup Series, the NASCAR XFINITY Series, the Verizon IndyCar Series and the Virgin Australia Supercars Championship. Siemens branding will be featured on all Team Penske Indy cars and on the uniforms worn by Team Penske drivers and teams competing in NASCAR.

The 2018 Monster Energy NASCAR Cup Series season began with the 60th anniversary running of the Daytona 500, where Team Penske cars earned fourth- and seventh-place finishes.

Ultimaker announced the integration of HP scanning software with its Ultimaker Cura. This integration significantly simplifies the workflow to 3D print scans from HP's Sprout and 3D Structured Light Scanner Pro S3.

The integration is another example in the growing list of Ultimaker Cura-supported 3D applications. Ultimaker has already created integrations with, among others, Siemens NX and SolidWorks, to ensure seamless 3D Printing workflows from CAD and PLM systems. HP is also working with software vendors to integrate solutions for end-to-end production of 3D printed parts, from design to production.

Frans Rintjema, Managing Director Immersive Computing at HP, explained: "This integration is filling a growing need in the market by embedding 3D printing capabilities into professional workflows. This enables customers to consider combining scanning and desktop 3D printing to replace obsolete parts, adding value in professional and education environments."

Paul Heiden, Senior Vice President Product Management at Ultimaker: "By allowing other parties, such as HP, to integrate Ultimaker Cura in their workflow unlocks a whole range of new possibilities for consumers and professionals to fully make use of 3D printing technology. The integration with HP's market-leading 3D scanning software really contributes to the adoption of professional desktop 3D printing. We're very proud to collaborate with HP to offer this for our customers."

For more than three decades, Sensors Expo & Conference has been the industry’s largest event dedicated to sensors, connectivity, and systems, bringing together thousands of highly qualified engineers from around the globe. Sensors Expo & Conference will take place in the heart of Silicon Valley, June 26-28 at the McEnery Convention Center in San Jose, California. New this year, Sensors will feature an IoT Connectivity Ecosystem, as well as two co-located events - the Medical Sensors Design Conference and the Autonomous Vehicle Sensors Conference – giving attendees the opportunity to dive deep into market specific sensing technologies and emerging applications, and hear from industry thought leaders across top vertical markets.

The sensor industry is changing at lightning quick speed, making it more important than ever for the engineering professionals involved in the design, development and deployment of sensor technologies to stay ahead of disruptive technologies and evolving trends. With this in mind, Sensors Expo highlights the most cutting-edge sensing technologies on the market today, and offers attendees the opportunity to explore the next generation of sensing technologies that are driving tomorrow’s solutions. As North America’s largest and most comprehensive program, Sensors features updated and expanded tracks, exciting and visionary Keynote Presentations, new Pre-Conference Symposia and more interactive content, applications, demos and hands on components than ever before.

Key highlights of the 2018 event include:

  • 10 Tracks with over 60 technical insights and case studies showcasing real sensors solutions from 100+ industry leading speakers
  • NEW tracks – Designing for Industrial and Embedded IoT, Machine Learning & AI, and Simplifying Complex Sensor Data
  • 4 Pre-Conference Symposia on MEMS Technologies, Energy Harvesting & Energy-Efficient Power Solutions, Smart Living through IoT Innovation, and Commercialization Opportunities for Printed, Flexible, Stretchable and Functional Fabric Sensors & Sensor-Based Systems for IoT and Wearables
  • Embedded Hands-On Workshops from Microchip and Microsemi
  • Hundreds of industry-leading and engaging speakers
  • Training Class: AI Development Platforms with Xilinx Adaptable Intelligence
  • Autotech Council & IoT Forum Meetings
  • Trusted Computing Group Workshop: Securing the IoT and Embedded Systems

The annual event attracts more than 6,500 professionals from over 40 countries, looking to share best practices, exchange ideas and make invaluable industry connections to drive business forward. According to Ruben Chicas of Phillips Industries, “Sensors Expo was an altogether exceptional experience. Unparalleled selection of vendors and presenters – truly the place to be if you’re looking to learn about what is happening or upcoming in the sensors world.”

From students to startups, Sensors Expo features it all:

  • Expo Theaters – Boosting with education, these theaters will provide free content ranging from Autonomous Vehicle Sensors to Embedded & Developer Programming to Startup Contests and Sensors Live.
  • IoT Connectivity Ecosystem & Influence Awards – Experience free demos and sessions from leading companies that have integrated sensors and connectivity into IoT solutions. Plus, see which companies are named winners for the first ever IoT Connectivity Ecosystem Influence Awards. Submission form available here.
  • Startup Review – Competing startups will reveal innovations that are set to shake up the automotive industry.
  • Startup Zone - Featuring cutting-edge startups in sensor technology.
  • University Zone - The central hub for all things Academia – Networking, Education Content, Poster Contest, and more.
  • Women in Sensors Engineering Program - Inspiring female engineers help to raise awareness of the contributions they make to the sensors community.

To date, nearly 250 companies from all over the world are scheduled to exhibit at the 2018 event, a 10% increase from last year at this time, including platinum sponsor Digi-Key, and gold sponsors Analog Devices, ROHM, and TE Connectivity. In addition to traditional exhibit space, Sensors also offers expanded exhibit and sponsorship opportunities including Technology Pavilions, New Product Showcases, Startup Opportunities, Branding, and more. Exhibitor sign up is available by contacting Joe Zuccerella.

“Unlike any other event, Sensors Expo & Conference is the only forum dedicated exclusively to sensors, connectivity and systems, designed to educate, inspire and connect the most qualified engineers and technologists in the market today,” said Mat Dirjish, Executive Editor, Sensors Online. “This year we are thrilled to expand our program and feature both the Medical Sensor Design and Autonomous Vehicle Sensor Conferences onsite, offering attendees even more access to the burgeoning sensors market and industry experts among key vertical markets.”

In a fierce competition against four other contenders, Norwich University emerged as the winning team in NASA's third Breakthrough, Innovative and Game-changing BIG Idea Challenge. The University of Colorado Boulder team was awarded second place.

In this engineering design competition, NASA enlists university teams from across the nation to develop creative solutions to some of the agency's most relevant challenges.

In 2017, NASA called for proposals for large power systems that could be used on the surface of Mars.  Because these systems need to be in place before humans ever arrive on the Red Planet, teams were required to propose robotic or autonomous solutions for deployment and sustainable operation.

The Norwich University team, led by Brian Bradke, proposed an innovative flexible solar array design using inflatable booms to provide a compact stowed configuration and low launch mass. The team made an impressive inflatable model that validated their packing and deployment concept.

The University of Colorado Boulder team, led by Kyri Baker, developed an autonomous foldable solar array concept that secured them the runner-up position. Their approach leveraged extremely lightweight/flexible composite booms that could be wrapped around a centralized hub and then unwound for deployment on the Martian surface.

The five finalists each proposed completely different, unique and viable concepts. Students from Norwich University, Princeton University, Texas A&M University, the University of Colorado Boulder and the University of Virginia presented their concepts to the judges in an intense design review during the 2018 BIG Idea Challenge Forum held March 6 and 7 in Cleveland, Ohio.

"This year's Big Idea Challenge brought some fresh and exciting ideas on Mars solar arrays that gives us greater confidence to move forward toward human Mars missions," said Lee Mason, principal technologist for power and energy storage with NASA's Space Technology Mission Directorate, and a Big Idea judge. "The two winning teams provide a nice diversity in their design and operational construct: one focusing on inflatables, the other on composite booms."

The BIG Idea Challenge is aligned with NASA's goal to increase the capabilities of the nation's future workforce through participatory, immersive educational experiences. This includes the challenge prize, which offers NASA internships to members from the winning team.

In a surprise twist during this year's competition, a new industry collaboration led to even more opportunities for the finalists. Bao Hoang of SSL served as an industry judge, and was so impressed with the quality of work and caliber of students that his company will be making internship offers and possibly job offers to those who participated in the final stage of the challenge.

"It has been an honor for SSL to collaborate with NASA and the NIA in helping to judge the 2018 BIG Idea Challenge," said Dario Zamarian, group president at SSL, a Maxar Technologies company. "The student teams have developed innovative concepts that reflect exceptional technical capabilities. In support of the program, SSL will invite multiple BIG Idea Challenge participants to join our summer internship program, where they will have the opportunity to work with a leading technology company that brings a commercial mindset to the development of next-generation space infrastructure."

The BIG Idea Challenge is sponsored by NASA Space Technology Mission Directorate's Game Changing Development Program, and managed by the National Institute of Aerospace.

Creaform announced the promotion Fanny Truchon as Business Unit Manager, effective March 1, 2018. Ms. Truchon succeeds Martin Lamontagne, Creaform founder and current Business Unit Manager.

With our new modern headquarters coming to full operational capacity and the management team’s unwavering focus on the next phase of Creaform’s long-term vision, I felt the time was now right for me to pursue the next chapter in my career,” comments Mr. Lamontagne. “Fanny has the proven management expertise, broad understanding of the dimensional-measurement market, and extensive internal experience to make a significant contribution to Creaform’s continued successful evolution.”

Ms. Truchon has served as Vice-President of Operations and Customer Support since 2013. During her tenure, she was responsible for the implementation of a world-class production and supply chain management system. She also played a key role in the relocation of its factory headquarters.

Ms. Truchon’s promotion is the culmination of more than 25 years of experience in the strategic management of manufacturing operations that includes positions with such industry leaders as Louis Garneau Sports and Procter & Gamble, at which she worked for 12 years.

“On behalf of AMETEK, I want to thank Martin for his dedication to Creaform and significant contributions in helping create its market vision,” states Bruce Wilson, Senior Vice President & General Manager, AMETEK Ultra Precision Technologies. “Under his inspiring leadership, Creaform has established itself among the ranks of global industry leaders in 3-D metrology.”

“Martin also led the successful 2013 integration of Creaform into AMETEK, following its acquisition. Now, with Fanny Truchon taking the lead, I am very confident that Creaform will continue to deliver exceptional results and provide exciting careers to its more than 500 employees worldwide,” adds Mr. Wilson.

With the recent inauguration of its new factory headquarters, Creaform continues its aggressive growth plan with more than 50 available positions at its new HQ and offices worldwide.

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