3DSUG announces 20111-2012 AMUG Board Members

Additive Manufacturing Users Group (AMUG), an organization for owners and operators of additive manufacturing equipment, announced the names of the 2011-2012 AMUG board members. Board members were selected at the annual business meeting held this year in Miami, Florida on April 6. The board will plan and organize the 2012 AMUG Conference.

“I’m honored to chair this organization and pleased to welcome new members to the board,”" said AMUG chairman Gary Rabinovitz. “We are working hard to extend our reach from 3D Systems Corporation equipment users to a broader audience that includes owners and operators of EOS, Objet, Stratasys and Z Corp equipment.”

The 2011-2012 AMUG board members are:

Chairman: Gary Rabinovitz, Reebok International

Vice Co-Chairman: Mark Abshire, DSM Somos

Vice Co-Chairman: Scott Schermer, SC Johnson

Secretary: Bret Bordner, Laser Reproductions

Treasurer: Guy Bourdeau, Huntsman Advanced Materials

Site Coordinator: Tom Sorovetz, Chrysler

Past Chairman: Tim Gornet, University of Louisville

Formerly known as 3DSUG, AMUG was established to encourage and coordinate technical information exchange between owners and operators of additive manufacturing equipment, including but not limited to, 3D Systems, EOS Electro Optical Systems, Objet Geometries, Stratasys and Z Corporation. AMUG meets annually to provide a forum for presentation of papers relating to the dissemination of processes and new technologies related to the operation of additive manufacturing equipment and the secondary or final application of parts or/and tools made from these systems. The event is sponsored by AIN Plastics, Air Filtration Systems, ALM, Boeing, buyCASTINGS, CadmiumCD, Clemco, Cyberbond, DPSS Lasers, DSM Somos, Engineering & Manufacturing Services, EOS, Evonik, Fineline Prototyping, Huntsman Advanced Materials, Industrial Experimental Technologies, Innovative Polymers, Integra, Objet, Laser Reproductions, Materialise, NCP Leasing, Neometrix, Northrop Grumman, Morris Technologies, Ophir-Spiricon, Paramount Industries, RAPID, RePliForm, RPDG, SLM Solutions, Society of Manufacturing Engineers, Solid Concepts, Time Compression, University of Louisville, VacuCoat, Valspar and Vorti-Siv.

For more information visit: www.am-ug.com

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